Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.

Abstract: A transformer includes a bobbin and a plurality of coils wound on the bobbin. The plurality of coils includes a first primary coil; a second primary coil, located above the first primary coil and electrically connected to the first primary coil; a secondary coil, located between the first primary coil and the second primary; a first auxiliary coil, located above the second primary coil; and a second auxiliary coil, located on the first auxiliary coil and electrically connected to the first auxiliary coil.

Abstract: An electronic assembly includes an electronic device and an external device. The electronic device includes a main body and a fixing base. The main body includes a first opening. The fixing base includes an upper cover, a cam, a first spring, a button, a second spring, a pedestal, a first retractable hook and a second retractable hook. The first retractable hook includes a first inclined protrusion structure. The second retractable hook includes a second inclined protrusion structure. The external device includes a bracket. The bracket includes a first insertion piece and a second insertion piece. The first insertion piece includes a seventh opening. The second insertion piece includes an eighth opening. The first insertion piece and the second insertion piece are penetrated through the first opening. The first inclined protrusion structure is inserted into the seventh opening. The second inclined protrusion structure is inserted into the eighth opening.

Abstract: A reading device for capacitive sensing element comprises a differential capacitive sensing element, a modulator, a charge-voltage conversion circuit, a phase adjustment circuit, a demodulator and a low-pass filter. The modulator outputs a modulation signal to the common node of the capacitive sensing element and modulates the output signal of the capacitive sensing element. The two input terminals of the charge-to-voltage conversion circuit are connected to two non-common nodes of the capacitive sensing element. The charge-to-voltage converter read the output charge of the capacitive sensing element and convert it into a voltage signal. The modulator generates a demodulation signal through the phase adjustment circuit. The demodulator receives the demodulation signal from the phase adjustment circuit and demodulates the output of the charge-to-voltage conversion circuit. The low-pass filter is connected to the output of the demodulator for filtering the demodulated voltage signal to output the read signal.

Abstract: An automatic adjustment method and an automatic adjustment device of a beam of a semiconductor apparatus, and a training method of a parameter adjustment model are provided. The automatic adjustment method of the beam of the semiconductor apparatus includes the following steps. The semiconductor apparatus generates the beam. A wave curve of the beam is obtained. The wave curve is segmented into several sections. The slope of each of the sections is obtained. Several environmental factors of the semiconductor apparatus are obtained. According to the slopes and the environmental factors, at least one parameter adjustment command of the semiconductor apparatus is analyzed through the parameter adjustment model.

Abstract: A multi-piece wheel frame includes a rim and a disc. The rim includes a barrel, and an outer rim portion protruding outwardly from the barrel. The outer rim portion forms an inclined surface, and a ring edge surface connected to an outer edge of the inclined surface and cooperating with the inclined surface to form an obtuse angle. The disc is fixed to the rim, and includes a disc core, a plurality of spoke portions extending radially outwardly from the disc core, and a reinforced ring portion connected to the spoke portions and fixed to the outer rim portion. The reinforced ring portion abuts against at least one of the inclined surface and the ring edge surface.

Abstract: A method for producing an adaptive element for dental implantation includes: creating a 3D virtual model including a crown part and a root part; obtaining a boundary curve between the crown part and the root part; defining a boundary plane on the root part perpendicular to a vertical axis of the 3D virtual model and spaced apart from the boundary curve; projecting the boundary curve on the boundary plane in a direction parallel to the vertical axis; generating a tubular model having a predetermined thickness based on the boundary curve, a virtual surface connected from the boundary curve to the cutting plane, and the cutting plane; and producing the adaptive element according to the tubular model.

Abstract: A method includes a step of obtaining plural pieces of training data each of which includes a different radiographic image of a bone and each of which has a label indicating one of an overt fracture, an occult fracture and no fracture, a step of using the plural pieces of training data to pre-train a deep convolutional network (DCN) model to obtain a preliminary DCN model, a step of determining a subset of the plural pieces of training data by at least excluding any piece of training data that has a label indicating occult fracture, and a step of using the subset to train the preliminary DCN model to obtain a first DCN model.

Abstract: The mat of the present invention includes a main body integrally formed by a plastic material. The main body at least has a first surface and a second surface adjacent to the first face. The first face and the second face have different surface physical characteristics. The first surface and the second surface are shaped into a third surface and a fourth surface respectively. The third surface and the fourth surface have a substantially same surface physical characteristic. An angle between the third surface and the fourth surface outside the main body is a specific value.

Abstract: A method for manufacturing a semiconductor structure includes forming a semiconductor portion which has an exposed region; forming two fin sidewalls which are disposed at two opposite sides of the exposed region of the semiconductor portion, and which include a dielectric material; and performing an etching process such that the exposed region of the semiconductor portion is etched away to form a recess while a protection layer is formed to protect each of the fin sidewalls during the etching process. Other methods for manufacturing the semiconductor structure are also disclosed.

Abstract: An electronic device is provided. The electronic device includes a circuit board, a first light-emitting element and a second light-emitting element disposed on the circuit board along a first direction. The electronic device includes a light guide plate and an adhesive structure between the circuit board and the light guide plate and having a first opening and a second opening. The electronic device includes a reflective layer disposed between the adhesive structure and the circuit board. The first and second light-emitting elements are disposed in the first and second openings respectively. A portion of the adhesive structure disposed between the first and second openings includes a first part and a second part, the first part is disposed between the first and second light-emitting elements, and the second part is connected with the first part and extends toward the light guide plate.

Abstract: A foldable light-shielding hood includes a plate body, a first supporting portion, a second supporting portion, a hanging portion, a first folded portion, and a second folded portion. The first supporting portion, the second supporting portion, and the hanging portion are foldably disposed to the plate body. The first folded portion is foldably disposed to the first supporting portion. The second folded portion is foldably disposed to the second supporting portion. The foldable light-shielding hood is adapted for hanging on a portable electronic device through the hanging portion. The first folded portion, the second folded portion, the hanging portion, the first supporting portion, the second supporting portion, and the plate body surround a shielding space, and the first folded portion, the second folded portion, and the hanging portion are adapted for being combined with the portable electronic device, and a display surface is located in the shielding space.

Abstract: The differential capacitor device includes a differential capacitor sensing component, a calibration capacitor assembly and two output terminals. The differential capacitive sensing element has a common point terminal, a first non-common point terminal and a second non-common point terminal, and the common point terminal is configured to receive an input voltage. The calibration capacitor assembly has a first calibration capacitor and a second calibration capacitor, one terminal of the calibration capacitor assembly is coupled to the first non-common point terminal and the second non-common point terminal, and the other terminal of the calibration capacitor assembly is configured to receive a first calibration voltage and a second calibration voltage. The two output terminals are respectively coupled to the first non-common point terminal and the second non-common point terminal to output a first signal and a second signal.

Abstract: The instant disclosure discloses an antibody or antigen-binding fragment thereof binding to Porcine Reproductive and Respiratory Syndrome Virus (PRRSV), and uses of such antibody or antigen-binding fragment thereof to create immunoassay methods or devices for PRRSV detection.

Abstract: A electronic device is provided. The electronic device includes a circuit board, a first light-emitting element and a second light-emitting element disposed on the circuit board along a first direction. The backlight module includes a light guide plate and an adhesive structure between the circuit board and the light guide plate and having a first opening and a second opening. The first and second light-emitting elements are disposed in the first and second openings respectively. A portion of the adhesive structure disposed between the first and second openings includes a first part and a second part, the first part is disposed between the first and second light-emitting elements, and the second part is connected with the first part and extends toward the light guide plate. A second maximum width of the second part is greater than a first maximum width of the first part along the first direction.

Abstract: A light-emitting device is provided, which includes a circuit board, a plurality of light-emitting elements, a first reflective element, and a second reflective element. The light-emitting elements are arranged on the circuit board. The first reflective element is disposed on the circuit board. The second reflective element is disposed on the first reflective element and comprises a plurality of apertures. The plurality of light-emitting elements are disposed in the plurality of apertures.

Abstract: The instant disclosure discloses an antibody or antigen-binding fragment thereof binding to Porcine Reproductive and Respiratory Syndrome Virus (PRRSV), and uses of such antibody or antigen-binding fragment thereof to create immunoassay methods or devices for PRRSV detection.

Abstract: The present disclosure provides a method for preparing a biochip. The method includes steps of coating a chip with a first solution of biotin to form a biotin-coated chip, wherein the biotin in the first solution is in a first concentration ranging from 0.1 to 1 ?g/ml; providing the biotin-coated chip with a second solution of avidin to form an avidin/biotin-coated chip, wherein the avidin in the second solution is in a second concentration ranging from 0.1 to 100 ?g/ml; and providing the avidin/biotin-coated chip with a third solution of a biotinylated probe to form the biochip, wherein the biotinylated probed in the third solution is in a third concentration ranging from 1 to 3 ?g/ml.

Abstract: The instant disclosure discloses an antibody or antigen-binding fragment thereof binding to Porcine Reproductive and Respiratory Syndrome Virus (PRRSV), and uses of such antibody or antigen-binding fragment thereof to create immunoassay methods or devices for PRRSV detection.