Patents by Inventor Fu-Kuo Tseng

Fu-Kuo Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9088401
    Abstract: A method for encoding or decoding digital data, a data dissemination device and a data managing device are provided. The method for encoding digital data includes the following steps. A digital data is received. A sign data is encoded into the digital data through a linear combination operation to obtain an encoded digital data, wherein the size of the digital data is not changed after the encoding process. The encoded digital data is disseminated.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: July 21, 2015
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jing-Shyang Hwu, Yung-Hsiang Liu, Fu-Kuo Tseng, Rong-Jaye Chen
  • Publication number: 20150052418
    Abstract: A method for encoding or decoding digital data, a data dissemination device and a data managing device are provided. The method for encoding digital data includes the following steps. A digital data is received. A sign data is encoded into the digital data through a linear combination operation to obtain an encoded digital data, wherein the size of the digital data is not changed after the encoding process. The encoded digital data is disseminated.
    Type: Application
    Filed: October 30, 2014
    Publication date: February 19, 2015
    Inventors: Jing-Shyang Hwu, Yung-Hsiang Liu, Fu-Kuo Tseng, Rong-Jaye Chen
  • Patent number: 8909544
    Abstract: A method for encoding or decoding digital data, a data dissemination device and a data managing device are provided. The method for encoding digital data includes the following steps. A digital data is received. A sign data is encoded into the digital data through a linear combination operation to obtain an encoded digital data, wherein the size of the digital data is not changed after the encoding process. The encoded digital data is disseminated.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: December 9, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Jing-Shyang Hwu, Yung-Hsiang Liu, Fu-Kuo Tseng, Rong-Jaye Chen
  • Publication number: 20120163445
    Abstract: A method for encoding or decoding digital data, a data dissemination device and a data managing device are provided. The method for encoding digital data includes the following steps. A digital data is received. A sign data is encoded into the digital data through a linear combination operation to obtain an encoded digital data, wherein the size of the digital data is not changed after the encoding process. The encoded digital data is disseminated.
    Type: Application
    Filed: August 15, 2011
    Publication date: June 28, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jing-Shyang Hwu, Yung-Hsiang Liu, Fu-Kuo Tseng, Rong-Jaye Chen
  • Publication number: 20050124169
    Abstract: A truncated dummy plate which is suitable for promoting substantially uniform flow of process gases among all regions on the surface of a substrate to facilitate deposition of a film having uniform thickness on the substrate. The truncated dummy plate has a circular shape with a flat edge provided in the curved edge of the dummy plate. At least two, and preferably, about three or four of the dummy plates are positioned in the sites on a wafer boat which are in relatively close proximity to a gas outlet in a process furnace typically during a LPCVD process carried out in the furnace. The flat or truncated edges of the dummy plates are disposed on the gas inlet side of the process chamber, with the round edges of the dummy plates disposed on the gas outlet side of the process chamber.
    Type: Application
    Filed: January 19, 2005
    Publication date: June 9, 2005
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen-Hsing Chen, Hsing-Jui Lee, Fu-Kuo Tseng, Ching-Ling Lee, Kuo-Hung Liao
  • Patent number: 6849131
    Abstract: A truncated dummy plate which is suitable for promoting substantially uniform flow of process gases among all regions on the surface of a substrate to facilitate deposition of a film having uniform thickness on the substrate. The truncated dummy plate has a circular shape with a flat edge provided in the curved edge of the dummy plate. At least two, and preferably, about three or four of the dummy plates are positioned in the sites on a wafer boat which are in relatively close proximity to a gas outlet in a process furnace typically during a LPCVD process carried out in the furnace. The flat or truncated edges of the dummy plates are disposed on the gas inlet side of the process chamber, with the round edges of the dummy plates disposed on the gas outlet side of the process chamber.
    Type: Grant
    Filed: October 5, 2002
    Date of Patent: February 1, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Yen-Hsing Chen, Hsing-Jui Lee, Fu-Kuo Tseng, Ching-Ling Lee, Kuo-Hung Liao
  • Publication number: 20040065261
    Abstract: A truncated dummy plate which is suitable for promoting substantially uniform flow of process gases among all regions on the surface of a substrate to facilitate deposition of a film having uniform thickness on the substrate. The truncated dummy plate has a circular shape with a flat edge provided in the curved edge of the dummy plate. At least two, and preferably, about three or four of the dummy plates are positioned in the sites on a wafer boat which are in relatively close proximity to a gas outlet in a process furnace typically during a LPCVD process carried out in the furnace. The flat or truncated edges of the dummy plates are disposed on the gas inlet side of the process chamber, with the round edges of the dummy plates disposed on the gas outlet side of the process chamber.
    Type: Application
    Filed: October 5, 2002
    Publication date: April 8, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yen-Hsing Chen, Hsing-Jui Lee, Fu-Kuo Tseng, Ching-Ling Lee, Kuo-Hung Liao