Abstract: The present invention discloses an adhesive composition for flexible printed circuit board comprising the following component: (a) an epoxy resin; (b) an accelerator having a structure of one of the following general formulas: wherein, E represents sulfur, nitrogen or phosphorus; Ar represents an aromatic ring; R1 is the same or different and represents a substituted or unsubatituted monovalent hydrocarbon group, a hydroxyl group, an alkoxy group, a nitro group, a cyano group or a halogen atom; R2 and R3 each represents a hydrogen atom and a methyl group; R4 is the same or different and represents a substituted or unsubstituted monovalent hydrocarbon group; R5 represents a substituted or unsubstituted pyridinium group; a represents an integer of 0 to 2; and b represents 2 to 3; (c) a nitrile rubber having carboxyl groups, and a carboxyl terminated butadiene acrylonitrile is preferred; and (d) an inorganic filler, an aluminum hydroxide is preferred.

Abstract: Disclosed is a novel two-step reaction method for preparing block copolyether-ester-amides. In the first step, caprolactam or other lactam is reacted with a polyether polyol in the presence of a catalyst to form an amino-terminated prepolymer with both a polyamide hard segment and a polyether soft segment. In the second step, the prepolymer is reacted with a dicarboxylic acid as a chain extender to form high molecular weight block copolyether-ester-amides.The block copolyether-ester-amides prepared by this method are transparent, easily moldable by conventional processing methods such as extrusion and injection molding, and exhibit excellent mechanical properties.