Patents by Inventor Fu Lei

Fu Lei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGE HAVING OFFSET VIAS
    Publication number: 20130341802
    Abstract: Integrated circuit packages comprise vias, each of which extends from a pad in communication with an integrated circuit on a semiconductor chip through insulating material overlying the semiconductor chip to an attachment surface facing a substrate. The portion of each via proximate the attachment surface is laterally offset from the portion proximate the pad from which it extends in a direction away from the centre of the semiconductor chip. Metallic material received in the vias mechanically and electrically interconnects the semiconductor chip to the substrate.
    Type: Application
    Filed: June 25, 2012
    Publication date: December 26, 2013
    Applicant: ADVANCED MICRO DEVICES, INC.
    Inventors: Michael Z. Su, Fu Lei, Frank Kuechenmeister