Patents by Inventor Fu-Lung Chen

Fu-Lung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6555592
    Abstract: A photothermosetting composition is described which contains a base resin (A), a photopolymerizable photomonomer or photooligomer (B), a photoinitiator (C), an epoxide compound containing at least two epoxy groups (D), and an organic solvent. The base resin (A) an epoxide compound (a) containing at least two epoxy groups, an unsaturated monobasic acid (b), a saturated or unsaturated dibasic acid (c), and a saturated or unsaturated acid anhydride (d) according to the ratio of (a)/(b)/(c) of 1:0.90˜0.95:0.025˜0.050 and the acid value of the base resin is in the range of 40˜49 mg KOH/g. This photothermosetting component was coating on the substrate, and then dried by baking, exposed by light, developed, irradiated by ultraviolet light or heated, and cured to form a solder mask.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: April 29, 2003
    Assignee: Advance Materials Corporation
    Inventors: Chao-Hui Tseng, Fu-Lung Chen
  • Publication number: 20020120031
    Abstract: This invention is to provide a kind of photothermosetting component, which was composed of a base resin (A), a photopolymerizable photomonomer or photooligomer (B), a photoinitiator (C), an epoxide compound containing at least two epoxy groups (D), and an organic solvent. A base resin (A) is composed of containing at least two epoxy groups of epoxide compound (a), containing at least two double bonds of unsaturated monobasic acid (b), a saturated or unsaturated dibasic acid (c), and a saturated or unsaturated acid anhydride (d) according to the typical ratio. This photothermosetting component was coating on the substrate, and then dried by baking, exposed by light, developed, irradiated by ultraviolet light or heated, and cured to form a solder mask.
    Type: Application
    Filed: February 27, 2001
    Publication date: August 29, 2002
    Inventor: Fu-Lung Chen
  • Patent number: 6080832
    Abstract: A diamine-containing polyamic acid alignment layer material provided by the polymerization of aromatic diamine and dianhydride, and having an excellent coating, adhesion and stability. After the polyamic acid alignment layer material is coated and cured at a high temperature, a polyamic acid alignment layer having a pretilt angle of below 2 degrees is formed due to a close ring reaction. The polyamic acid alignment layer with a low pretilt angle can be used in a TN (twisted nematic) type liquid crystal display.
    Type: Grant
    Filed: September 10, 1998
    Date of Patent: June 27, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Fu-Lung Chen, Ted Hong Shinn, Wen Hishin Wang, Chein-Dhau Lee
  • Patent number: 5236799
    Abstract: An electrophotographic toner composition for development of images, comprising:(a) an amount of 45 to 95% by weight of resin of which the dynamic viscosity after compounded and being fixed onto rollers, having been tested at a frequency rate of 6.28 RAD/sec, a strain of 10% being less than 20000 poise and dissipation factor being smaller or equal to 1.3, and(b) a releasing agent being less than 3% by weight.
    Type: Grant
    Filed: December 4, 1991
    Date of Patent: August 17, 1993
    Assignee: Industrial Technology Research Institute
    Inventors: Fu-Lung Chen, Hun-Yi Tong, Chao-Wen Niu
  • Patent number: 4762747
    Abstract: Described is a single component aqueous adhesive composition especially suitable for flexible printed circuits. The composition consists of water and a homogeneous film-forming acrylic polymer. The acrylic polymer is a polymerization product of (A) acrylonitrile or methacrylonitrile, or mixture thereof, (B) an alkyl acrylate or methacrylate having 1-12 carbon atoms in the alkyl group, or mixture thereof, (C) an oxirane-containing polymerizing ethylenic monomer and (D) a hydroxyl- or amide-containing acrylate or methacrylate.The adhesive composition is useful for bonding metal foils to polyimide films in the manufacture of flexible printed circuits.
    Type: Grant
    Filed: July 29, 1986
    Date of Patent: August 9, 1988
    Assignee: Industrial Technology Research Institute
    Inventors: Jonq-Min Liu, Fu-Lung Chen, Yeong-Cherng Chiou