Abstract: A cavity forming method includes the steps of: providing the material modification processing device; according to the cavity topography of the workpiece, utilizing the material modification processing device to perform local modification including: calculating the laser-light shaping and scanning information, and based on the laser-light shaping and scanning information to have the optical axis adjustment unit to adjust positions of the laser-light shaping and scanning processing module and the processing stage, such that the area of the workpiece to be projected by the Bessel beam can be formed as the modified area; and, etching the modified area to form a cavity of the cavity topography. In additional, a material modification processing device is also provided.

Abstract: A method for generating Bessel beams includes the steps of: utilizing a light source to generate an incident beam to a phase modulation module; utilizing the phase modulation module to rectify the incident beam into a circular beam, and to modulate a phase of the circular beam into an asymmetric phase so as to form an asymmetric collimated circular beam provided to a scanning module; utilizing the scanning module to compensate the asymmetric collimated circular beam, and utilizing the asymmetric collimated circular beam to scan at different angles and then enter a focusing element; and, utilizing the focusing element to focus and interfere the asymmetric collimated circular beam into form a Bessel beam for machining.

Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.

Abstract: An adjustment method of laser light path includes the steps of: having a laser light path to penetrate through a measuring device to obtain at least two laser focal positions of the laser light path, the at least two laser focal positions forming an arc path; applying a focal position-calculating device to calculate coordinate values of the at least two laser focal positions; based on the arc path and the coordinate values of the at least two laser focal positions to apply the focal position-calculating device to calculate a target laser focal position; and, based on the target laser focal position to apply a light modulator to adjust each of the at least two laser focal positions to the target laser focal position. In addition, an adjustment device of laser light path is also provided.

Abstract: A cutting method for forming a chamfered corner includes a step of selecting a light pattern-adjusting module according to a pre-cut chamfer angle, a step of the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate, a step of the light pattern-adjusting module adjusting an axial energy distribution of a light pattern of the laser beam to vary an appearance of the modified region so as to form the modified region fulfilling the pre-cut chamfer angle, and a step of etching the substrate having the modified region to form a chamfered surface on the substrate by cutting the modified region from the substrate.

Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.

Abstract: A cutting method for forming a chamfered corner includes a step of selecting a light pattern-adjusting module according to a pre-cut chamfer angle, a step of the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate, a step of the light pattern-adjusting module adjusting an axial energy distribution of a light pattern of the laser beam to vary an appearance of the modified region so as to form the modified region fulfilling the pre-cut chamfer angle, and a step of etching the substrate having the modified region to form a chamfered surface on the substrate by cutting the modified region from the substrate.