Abstract: Disclosed is a printed circuit board (PCB) design for a multi-flex PCB system aimed at wearable devices that is capable of meeting requirements such as ultra-thin thickness profile of the board (thereby allowing 360 degree of bendability) and less manufacturing cost, as desired by consumer electronics, such as wearable motion controlled mobile gaming devices. The PCB design suggests two thickness levels for the multi-flex PCB system. The thicker parts are four-layer sections with 20 mils thickness and thinner parts are two-layer sections with 7-8 mils thickness. The ground and supply planes are only solid on the four-layer sections. Since the two-layer segments including signal paths are completely bendable, the entire rectangular board can bend as a cycle. This two thickness-level structure can be easily modified to three thickness-level structure with the third three-layer sections with 12-13 mils thickness. The three thickness-level structure is to accommodate more complicated electronics circuit design.