Abstract: The present disclosure provides a semiconductor structure and a method of manufacturing a semiconductor structure. The semiconductor structure includes a substrate, semiconductor structures, an isolation layer, an adhesive layer, a metal layer, a metal nitride layer, a semiconductor layer, a profile modifier layer, and a disconnection structure. The semiconductor structures are disposed on the substrate. The isolation layer is disposed between the semiconductor structures. The metal layer is disposed on an adhesive layer. The metal nitride layer is disposed on the metal layer. The semiconductor layer is disposed on the metal nitride layer. The profile modifier layer is disposed on the semiconductor layer. The disconnection structure is disposed and extending from the profile modifier layer to the isolation layer. A first width of the disconnection structure in the profile modifier layer is substantially the same as a second width of the disconnection structure in the isolation layer.

Abstract: A micro-reed switch includes a first magnetic reed and a second magnetic reed. The first magnetic reed includes a first metal electrode and a first non-wettable area. The first metal electrode includes a liquid metal. The second magnetic reed includes a second metal electrode and a second non-wettable area. The first magnetic reed and second magnetic reed is parallel to each other and a gap is defined there between. When a magnetic field is available, the liquid metal and the second metal electrode are engaged with one another by a magnetic force of the magnet.

Abstract: A micro-reed switch includes a first magnetic reed and a second magnetic reed. The first magnetic reed includes a first metal electrode and a first hydrophobic area. The first metal electrode includes a liquid metal. The second magnetic reed includes a second metal electrode and a second hydrophobic area. The first magnetic reed and second magnetic reed is parallel to each other and a gap is defined there between. When a magnetic field is available, the liquid metal and the second metal electrode are engaged with one another by a magnetic force of the magnet.

Abstract: A fuel cell, a plate having through-plane conductivity and a manufacturing method of the plate are disclosed. The plate having through-plane conductivity includes a substrate and a plurality of linear conductors. The linear conductors are respectively coated with a metal material, and are oriented by a magnetic field to arrange in the substrate with an extending direction perpendicular to a plane surface of the substrate. The substrate is made of an epoxy resin material, the linear conductors are carbon fibers, and the metal material is a magnetic material, such as iron, cobalt or nickel. The fuel cell includes bipolar plates that are respectively made of the above-described plate having through-plane conductivity.