Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. The independent flow channels communicate with each other. And, the independent flow channels respectively have an amount of working fluid filled therein.

Abstract: A roll bond plate evaporator structure is disclosed. The roll bond plate evaporator structure includes a heat dissipation member, at least one inlet and at least one outlet. The heat dissipation member is composed of a first plate body and a second plate body, which are correspondingly mated with each other. The first and second plate bodies together define a flow way. A working fluid is filled in the flow way. The inlet is formed at one end of the heat dissipation member in communication with the flow way and the outlet is formed at the other end of the heat dissipation member in communication with the flow way.

Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. And, the independent flow channels respectively have an amount of working fluid filled therein.

Abstract: A roll bond plate evaporator structure is disclosed. The roll bond plate evaporator structure includes a heat dissipation member, at least one inlet and at least one outlet. The heat dissipation member is composed of a first plate body and a second plate body, which are correspondingly mated with each other. The first and second plate bodies together define a flow way. A working fluid is filled in the flow way. The inlet is formed at one end of the heat dissipation member in communication with the flow way and the outlet is formed at the other end of the heat dissipation member in communication with the flow way.

Abstract: A manufacturing method of a roll bond plate evaporator structure is disclosed. The roll bond plate evaporator structure includes a heat dissipation member, at least one inlet and at least one outlet. The heat dissipation member is composed of a first plate body and a second plate body, which are correspondingly mated with each other. The first and second plate bodies together define a flow way. A working fluid is filled in the flow way. The inlet is formed at one end of the heat dissipation member in communication with the flow way and the outlet is formed at the other end of the heat dissipation member in communication with the flow way.

Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. And, the independent flow channels respectively have an amount of working fluid filled therein.

Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. The independent flow channels communicate with each other. And, the independent flow channels respectively have an amount of working fluid filled therein.

Abstract: A heat exchanger structure with flow divider includes a heat-conductive main body provided with a flow passage having at least one inner turn and one outer turn, and at least one flow divider located near and downstream the inner turn, such that a cooling liquid in the flow passage flowing through the inner and the outer turn to reach at the flow divider is divided by the flow divider into two smaller flows. Therefore, the cooling liquid in the flow passage has reduced pressure drop and it is not necessary to increase the operating power of a pump that delivers the cooling liquid into the flow passage.

Abstract: A flow passage structure for water-cooling device includes a heat-conductive main body provided with at least one flow passage, an inlet, and an outlet; and at least one vortex-forming section. The flow passage is provided in the heat-conductive main body and has a type of cooling liquid contained therein. The flow passage includes a channel portion and a top portion integrally connected to one another to ensure a leak-free flow passage. The at least one vortex-forming section is provided on one of the channel portion and the top portion for the cooling liquid flowing therethrough to form separated vortexes, so as to enable largely increased flow field turbulence in the flow passage and accordingly upgraded heat transfer performance of the cooling liquid.