Patents by Inventor Fuquan Pang

Fuquan Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8665564
    Abstract: A suspension comprises a flexure and a plurality of electrical traces. The flexure has a leading portion and a tailing portion, and has a laminated structure comprising a substrate layer, a dielectric layer, and a grounding layer sandwiched therebetween. The electrical traces comprise at least one pair of write traces, each write trace has a bonding pad positioned on the leading portion, a terminal pad positioned on the tailing portion, and a write wire connecting the bonding pad and the terminal pad, the write wire has at least one portion being furcated into at least two sub wires. The present invention can lower the impedance and decrease the signal transmission loss, and widen the frequency bandwidth simultaneously. The invention also discloses a HGA and a disk drive unit.
    Type: Grant
    Filed: June 15, 2010
    Date of Patent: March 4, 2014
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Haiming Zhou, Xianwen Feng, Tamotsu Tani, Fuquan Pang, Jinbo Qiu
  • Publication number: 20110228426
    Abstract: A suspension comprises a flexure and a plurality of electrical traces. The flexure has a leading portion and a tailing portion, and has a laminated structure comprising a substrate layer, a dielectric layer, and a grounding layer sandwiched therebetween. The electrical traces comprise at least one pair of write traces, each write trace has a bonding pad positioned on the leading portion, a terminal pad positioned on the tailing portion, and a write wire connecting the bonding pad and the terminal pad, the write wire has at least one portion being furcated into at least two sub wires. The present invention can lower the impedance and decrease the signal transmission loss, and widen the frequency bandwidth simultaneously. The invention also discloses a HGA and a disk drive unit.
    Type: Application
    Filed: June 15, 2010
    Publication date: September 22, 2011
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Haiming Zhou, Xianwen Feng, Tamotsu Tani, Fuquan Pang, Jinbo Qiu