Abstract: Disclosed is an ultrasonic transducer array configured to generate ultrasonic waves. The ultrasonic transducer array includes multiple transducers arranged along a first direction. Each of the transducers has multiple grooves arranged along a second direction perpendicular to the first direction. The grooves extends along the first direction. A density of the grooves along the second direction decreases from both ends of the transducer toward a center of the transducer.

Abstract: An ultrasonic oscillator element, including a substrate, a first lower electrode, a first insulating layer, a second insulating layer, a second lower electrode, a first upper electrode, and a third insulating layer. The first lower electrode is disposed on the substrate. The first insulating layer is disposed so that the first lower electrode is located between the first insulating layer and the substrate. The second insulating layer and the first insulating layer form a first cavity. The second lower electrode is disposed adjacent to the first side of the second insulating layer and located in the outer region of the first cavity. The first upper electrode is disposed on the second side of the second insulating layer. The third insulating layer is disposed so that the second lower electrode is located between the third insulating layer and the first insulating layer.

Abstract: An ultrasonic transducer device includes a substrate, an ultrasonic oscillation unit, a ground signal line, a DC voltage signal line and an AC voltage signal line. The substrate includes an active component area and a wiring area located around the active component area. The ultrasonic oscillation unit includes a first electrode layer, a second electrode layer, a third electrode layer and a cavity. The first electrode layer is located on a first side of the cavity, and the second electrode layer and the third electrode layer are located on a second side of the cavity. The ground signal line, disposed in the wiring area, is electrically connected to the first electrode layer. The DC voltage signal line, disposed in the wiring area, is electrically connected to the second electrode layer. The AC voltage signal line, disposed in the wiring area, is electrically connected to the third electrode layer.

Abstract: An ultrasonic vibration sub-element including a substrate, a ground layer, a first insulation layer, a second insulation layer, a first electrode layer, a third insulation layer, and a second electrode layer is provided. The first electrode layer is configured to receive a direct current voltage. The second electrode layer is configured to receive an alternating current signal. Before the ultrasonic vibration sub-element is driven, there is a cavity between the first insulation layer and the second insulation layer. When the ultrasonic vibration sub-element is driven, the first electrode layer receives the direct current voltage and is configured to at least drive the second insulation layer to shrink toward the cavity. The second electrode layer receives the alternating current signal and is configured to at least drive the third insulation layer to vibrate. An ultrasound probe is also provided.

Abstract: An ultrasonic transducer array including a plurality of transducers is provided. The transducers are arranged in an array along an arrangement direction and include a plurality of first transducers and a plurality of second transducers. Every two first transducers of the first transducers sequentially form a plurality of first channels along the arrangement direction. Every m second transducers of the second transducers sequentially form a plurality of second channels along the arrangement direction, where m?2. The first transducers and the second transducers are arranged staggeredly along the arrangement direction. A first pitch between any two adjacent first channels in the first channels is less than a second pitch between any two adjacent second channels in the second channels. A resolution of the first channels being driven to scan is lower than a resolution of the second channels being driven to scan. An ultrasound probe is also provided.

Abstract: An ultrasonic transceiver device and a control method thereof are disclosed. The ultrasonic transceiver device includes a plurality of coupled ultrasonic transceiver units. Each of the ultrasonic transceiver units includes a plurality of ultrasonic oscillators, a driving bias circuit coupled to the ultrasonic oscillators and used to receive an alternating current (AC) voltage, and a switching circuit coupled to the driving bias circuit. The switching circuit has a plurality of switching paths corresponding to a plurality of impedance values or a plurality of inductance values. The switching circuit is used to switch a system driving signal to pass through one of the switching paths according to a mode selection signal and transmitted to the driving bias circuit as the AC voltage.

Abstract: An ultrasonic transducer device and a manufacturing method thereof are provided. The ultrasonic transducer device includes a substrate, an ultrasonic oscillation unit and an upper insulating layer. The ultrasonic oscillation unit is disposed on the substrate and configured to emit or receive an ultrasonic wave. The ultrasonic wave has a resonant frequency. The upper insulating layer covers the ultrasonic oscillation unit. The upper insulating layer has a film thickness positively related to the resonant frequency.

Abstract: An ultrasonic sensor has a capacitance micromachined ultrasonic transducer (CMUT) with three metal layers and four insulating layers. A first metal layer receives a reference voltage, a second metal layer receives a direct current voltage, and a third metal layer receives an alternating current voltage. A cavity formed between the first metal layer and the second metal layer allows for mechanical vibration of the CMUT, which generates ultrasonic waves.

Abstract: An ultrasonic transducer device including a substrate and an ultrasonic oscillation unit is provided. The ultrasonic oscillation unit is disposed on the substrate. The ultrasonic oscillation unit includes a first electrode layer, a first insulating layer, a second electrode layer, a second insulating layer, a plurality of capacitor protrusions, and a cavity located between the first insulating layer and the second insulating layer. The capacitor protrusions are disposed in the cavity by being disposed on at least one of the first insulating layer and the second insulating layer. The first insulating layer and the second insulating layer are separated by a gap and are located between the first electrode layer and the second electrode layer. The height of each of the capacitor protrusions is less than a height of the gap.

Abstract: The present disclosure is related to an ultrasonic module and an ultrasonic probe having the same. The ultrasonic module comprises a frame component, an ultrasonic oscillating component, an acoustic lens and an adhesive component. The ultrasonic oscillating component is accommodated in the frame component. The acoustic lens is disposed on the frame component. The adhesive component is accommodated in the frame component. The frame component is disposed between the acoustic lens and the ultrasonic oscillating component. The frame component has a first opening 10 formed at one end adjacent to the acoustic lens. The ultrasonic oscillating component is disposed on a side of the first opening close to the adhesive component. The acoustic lens is in contact with the ultrasonic oscillating component through the first opening.

Abstract: A probe including a shell, an ultrasonic transducer unit, and at least one circuit board is provided. The ultrasonic transducer unit is disposed in the shell and includes a substrate, a vibrating membrane, and an anti-resonance structure. The vibrating membrane is disposed on the substrate and forms a cavity with the substrate. The anti-resonance structure is disposed on one side of the substrate facing away from the vibrating membrane and includes a hard layer and a glue layer connected to each other. The density of the glue layer is different from the density of the hard layer. The at least one circuit board is electrically coupled to the ultrasonic transducer unit. A method of fabricating the ultrasonic transducer unit is also provided.

Abstract: Disclosed is an ultrasonic transducer including a substrate and multiple ultrasonic transducer units. The substrate has an ultrasonic transceiver area. The ultrasonic transducer units, each including a first electrode, multiple first cavities and a second electrode, are arranged at intervals on the substrate along a first direction. The first electrode and the first cavities, which overlap the first electrode, are disposed in the ultrasonic transceiver area. The first cavities are arranged at intervals along a second direction. The second electrode extends on the first cavities along the second direction, overlapping the first electrode and the first cavities. The second electrode is electrically-insulated from the first electrode. The second electrode has a first width along the first direction in the ultrasonic transceiver area, and the first width of the second electrode remains fixed or unchanged along the second direction. A method of fabricating the ultrasonic transducer is also provided.

Abstract: A multifunctional probe includes a hand-held housing, a signal detector and an array probe. The signal detector is flexibly disposed on the hand-held housing or at its first end. The array probe is disposed at one end (e.g., second end) of the hand-held housing and electrically coupled to the signal detector. The first contact time of the signal detector in contact with the living body may at least partially overlap with the second contact time of the array probe in contact with the living body. The signal detector and the array probe generate the first electronic signal. The multifunctional probe includes a flexibly-connected signal detector and an array probe, which can contact and/or detect the living body at the same time. Thus, the detection efficiency and accuracy are effectively increased. A detection method applied to the multifunctional probe is also provided.

Abstract: An ultrasonic transducer includes an ultrasonic transducer unit array and a circuit layer. The ultrasonic transducer unit array includes: a plurality of first array units and a plurality of second array units. At least two adjacent ones of the first array units are arranged along a first direction to form a first series string; at least two adjacent ones of the second array units are arranged along a second direction to form a second series string; the first series string and the second series string are intersected; and the first direction and the second direction form a non-180° angle. The circuit layer includes a first bridging unit connected in series with the first array units; and a second bridging unit connected in series with the second array units. The second bridging unit and the first bridging unit are not directly electrically connected to each other.

Abstract: An ultrasonic array manufacturing method is applied to an ultrasonic array and includes providing a piezoelectric material layer has at least one or a plurality of piezoelectric units with a first lateral side and a second lateral side opposite to each other, forming a first cutting slot in an oblique manner along a direction from the first lateral side to the second lateral side of each piezoelectric unit, forming a second cutting slot crossed by the first cutting slot on each piezoelectric unit, and coupling two electrode surfaces of each piezoelectric unit respectively to a first lead wire and a second lead wire.

Abstract: The present disclosure provides a transducer for generating ultrasonic waves to detect an object and an ultrasonic probe using the same. The transducer includes a piezoelectric layer. The piezoelectric layer has a first surface and a second surface opposite to the first surface. The first surface is farther from the object than the second surface and includes a curved structure protruded along a first direction away from the object. The ultrasonic probe includes a handle component and a transducer. The transducer is arranged at one end of the handle component.

Abstract: An underwater ultrasonic device includes a curvilinear ultrasonic transducer and a plurality of straight linear ultrasonic transducers. The straight linear ultrasonic transducers are disposed with respect to the curvilinear ultrasonic transducer. A first angle is included between the straight linear ultrasonic transducers. One of the curvilinear ultrasonic transducer and the straight linear ultrasonic transducer is configured to transmit a plurality of ultrasonic signals. Another one of the curvilinear ultrasonic transducer and the straight linear ultrasonic transducer is configured to receive a plurality of reflected signals of the ultrasonic signals.

Abstract: A photoacoustic imaging device is suitable for performing photoacoustic imaging on an object to be tested and includes a light emitting device and a light-transmissible ultrasonic transducer. The light emitting device emits a beam along an optical axis. The light-transmissible ultrasonic transducer is disposed on the light emitting device at the optical axis and includes a transparent substrate and a plurality of ultrasonic transducer units. The plurality of ultrasonic transducer units is disposed on the transparent substrate and allows the beam to pass therethrough and be incident to the object to be tested along the optical axis, for coaxially receiving an ultrasound transmitted from the object to be tested along the optical axis after the beam is incident into the object to be tested.

Abstract: An ultrasonic transducing module, including a base, a piezoelectric ultrasonic transducer, and a micromachined ultrasonic transducer, is provided. The piezoelectric ultrasonic transducer is disposed on the base. The micromachined ultrasonic transducer is disposed on the piezoelectric ultrasonic transducer. The piezoelectric ultrasonic transducer is disposed between the base and the micromachined ultrasonic transducer. An ultrasonic wave emitted by the piezoelectric ultrasonic transducer penetrates the micromachined ultrasonic transducer and is then transmitted to the outside. An ultrasonic probe is also provided.

Abstract: An ultrasonic transducer module including a first electrode layer, a second electrode layer, a first piezoelectric material layer, a third electrode layer, a fourth electrode layer, a second piezoelectric material layer, and an insulation layer is provided. The first piezoelectric material layer is disposed between the first electrode layer and the second electrode layer. The second electrode layer is disposed between the first piezoelectric material layer and the third electrode layer. The second piezoelectric material layer is disposed between the third electrode layer and the fourth electrode layer. The insulation layer is disposed between the second electrode layer and the third electrode layer.