Patents by Inventor FU-SHENG KE

FU-SHENG KE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11757087
    Abstract: Methods are provided for forming an electrode. The method can comprise thermally reducing GeO2 powders at a reducing temperature of 300° C. to 600° C. to produce Ge particles; mixing the Ge particles with an organic binder and a carbon source; and pressing the Ge particles with the binder and the carbon source to form the electrode. Electrodes are also provided that include a plurality of microparticles comprising Ge grains, an organic binder, and a carbon source, wherein the Ge grains comprise cubic Ge and are bonded together to form Ge particles, and wherein the Ge grains define nanopores within the electrode.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: September 12, 2023
    Assignee: University of South Carolina
    Inventors: Xiao-Dong Zhou, Kuber Mishra, Fu-Sheng Ke
  • Patent number: 11417884
    Abstract: A titanium disulfide-sulfur (TiS2—S) composite particle contains a titanium disulfide (TiS2) substrate having solid elemental sulfur (S) disposed directly on a surface of the TiS2. The TiS2 substrate has a layered crystalline hexagonal structure of space group P-3 ml and includes at least 100 distinct layers. The TiS2 and S are present in the composite in a weight ratio (TiS2:S) of 20:80 to 50:50. Cathodes and batteries containing the composite particle, as well as related methods, are also disclosed.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: August 16, 2022
    Assignees: CORNELL UNIVERSITY, WUHAN UNIVERSITY
    Inventors: Héctor D. Abruña, Yao Yang, Fu-Sheng Ke, Xiao-Chen Liu
  • Publication number: 20210194004
    Abstract: A titanium disulfide-sulfur (TiS2—S) composite particle contains a titanium disulfide (TiS2) substrate having solid elemental sulfur (S) disposed directly on a surface of the TiS2. The TiS2 substrate has a layered crystalline hexagonal structure of space group P-3 ml and includes at least 100 distinct layers. The TiS2 and S are present in the composite in a weight ratio (TiS2:S) of 20:80 to 50:50. Cathodes and batteries containing the composite particle, as well as related methods, are also disclosed.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 24, 2021
    Applicants: CORNELL UNIVERSITY, WUHAN UNIVERSITY
    Inventors: Héctor D. ABRUÑA, Yao YANG, Fu-Sheng KE, Xiao-Chen LIU
  • Publication number: 20210184203
    Abstract: Methods are provided for forming an electrode. The method can comprise thermally reducing GeO2 powders at a reducing temperature of 300° C. to 600° C. to produce Ge particles; mixing the Ge particles with an organic binder and a carbon source; and pressing the Ge particles with the binder and the carbon source to form the electrode. Electrodes are also provided that include a plurality of microparticles comprising Ge grains, an organic binder, and a carbon source, wherein the Ge grains comprise cubic Ge and are bonded together to form Ge particles, and wherein the Ge grains define nanopores within the electrode.
    Type: Application
    Filed: February 3, 2021
    Publication date: June 17, 2021
    Inventors: XIAO-DONG ZHOU, KUBER MISHRA, FU-SHENG KE
  • Patent number: 10944101
    Abstract: Methods are provided for forming an electrode. The method can comprises: thermally reducing GeO2 powders at a reducing temperature of 300° C. to 600° C. to produce Ge particles; mixing the Ge particles with an organic binder and a carbon source; and pressing the Ge particles with the binder and the carbon source to form the electrode. Electrodes are also provided that include a plurality of microparticles comprising Ge grains, an organic binder, and a carbon source, wherein the Ge grains comprise cubic Ge and are bonded together to form Ge particles, and wherein the Ge grains define nanopores within the electrode.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: March 9, 2021
    Assignee: University of South Carolina
    Inventors: Xiao-Dong Zhou, Kuber Mishra, Fu-Sheng Ke
  • Publication number: 20150249247
    Abstract: Methods are provided for forming an electrode. The method can comprises: thermally reducing GeO2 powders at a reducing temperature of 300° C. to 600° C. to produce Ge particles; mixing the Ge particles with an organic binder and a carbon source; and pressing the Ge particles with the binder and the carbon source to form the electrode. Electrodes are also provided that include a plurality of microparticles comprising Ge grains, an organic binder, and a carbon source, wherein the Ge grains comprise cubic Ge and are bonded together to form Ge particles, and wherein the Ge grains define nanopores within the electrode.
    Type: Application
    Filed: March 2, 2015
    Publication date: September 3, 2015
    Inventors: Xiao-Dong Zhou, Kuber Mishra, Fu-Sheng Ke
  • Publication number: 20090074310
    Abstract: An image data compression method is disclosed. Firstly, check a variance between a first image data and a second image data for comparing the variance with a threshold value. When the variance is smaller than a threshold value, compare the first image data with the second image data to generate a motion vector and compress the motion vector. Then calculate the first image data and the second image data according to the motion vector so as to get an offset value of the motion vector. Next, encode the offset value of the motion vector, compress the offset value of the motion vector, and encode as well as compress the first image data. Thus the compression ratio is improved and image distortion is avoided.
    Type: Application
    Filed: September 19, 2007
    Publication date: March 19, 2009
    Applicant: CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M.N.D.
    Inventors: SHAOU-GANG MIAOU, FU-SHENG KE, CHIH-CHING CHANG, CHUEN-TAI YEH, TAH-YEONG LIN, SHU-CHING CHEN