Abstract: A method for cooling a heat source by liquefied gas is provided, wherein the heat source is cooled by filling a liquefied gas into a chamber close to the heat source, and the heat source is located in an electronic device. The temperature of the heat source is detected, and the liquefied gas is filled into the chamber via an inlet valve to absorb heat generated by the heat source when the temperature of the heat source rises to a first value. Specifically, an exhaust valve that communicates with the chamber is opened when the temperature of the heat source decreases and then rises to a second value or the pressure inside the chamber reaches a critical value, so that the liquefied gas in the chamber can be vaporized and discharged through the exhaust valve to an atmospheric environment.

Abstract: A method for cooling a heat source by liquefied gas is provided, wherein the heat source is cooled by filling a liquefied gas into a chamber close to the heat source, and the heat source is located in an electronic device. The temperature of the heat source is detected, and the liquefied gas is filled into the chamber via an inlet valve to absorb heat generated by the heat source when the temperature of the heat source rises to a first value. Specifically, an exhaust valve that communicates with the chamber is opened when the temperature of the heat source decreases and then rises to a second value or the pressure inside the chamber reaches a critical value, so that the liquefied gas in the chamber can be vaporized and discharged through the exhaust valve to an atmospheric environment.

Abstract: A packaging structure is provided, including a bottom plate, an arching roof, and a bent portion. The arching roof connects to the bottom plate and forms a first curved surface. An opening is formed between the first curved surface and the bottom plate. The bent portion is connected to the bottom plate and is adjacent to the opening.