Patents by Inventor Fu-Shiung Hsu

Fu-Shiung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7064032
    Abstract: A method for forming a non-volatile memory cell includes depositing an oxide layer over a component stack including a dielectric layer over a first conductive layer. A portion of an upper section of the oxide layer is removed such that the dielectric layer is exposed. The dielectric layer and a remainder of the oxide layer upper section are removed such that upper surfaces of the oxide layer and the first conductive layer are substantially planar. A second conductive layer is formed over the upper surfaces of the first conductive layer and the oxide layer. A non-volatile memory array is formed including multiple spaced and parallel bit lines in a substrate surface. Multiple stacked layers, including an electron trapping layer, are on the substrate surface over the bit lines. Multiple spaced word lines are over the stacked layers. The word lines are parallel to one another and perpendicular to the bit lines.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: June 20, 2006
    Assignee: Macronix International Co., Ltd.
    Inventors: Fu Shiung Hsu, Chen Chin Liu, Lan Ting Huang
  • Publication number: 20050142763
    Abstract: A disclosed method for forming a non-volatile memory cell includes forming a component stack including an electron trapping layer on a substrate surface. A dielectric layer is formed over the component stack, and a portion is removed such that a remainder of the dielectric layer exists substantially along sidewalls of the component stack. An oxide layer is formed over a bit line in the substrate adjacent to the component stack, and an electrically conductive layer is formed over the component stack and the oxide layer. A described non-volatile memory cell includes a component stack on a substrate surface, the component stack including an electron trapping layer. Multiple dielectric spacers are positioned along sidewalls of the component stack. An oxide layer is positioned over a bit line in the substrate adjacent to the component stack, and an electrically conductive layer is positioned over the component stack and the oxide layer.
    Type: Application
    Filed: February 24, 2005
    Publication date: June 30, 2005
    Inventors: Fu-Shiung Hsu, Chen-Chin Liu
  • Patent number: 6869843
    Abstract: A disclosed method for forming a non-volatile memory cell includes forming a component stack including an electron trapping layer on a substrate surface. A dielectric layer is formed over the component stack, and a portion is removed such that a remainder of the dielectric layer exists substantially along sidewalls of the component stack. An oxide layer is formed over a bit line in the substrate adjacent to the component stack, and an electrically conductive layer is formed over the component stack and the oxide layer. A described non-volatile memory cell includes a component stack on a substrate surface, the component stack including an electron trapping layer. Multiple dielectric spacers are positioned along sidewalls of the component stack. An oxide layer is positioned over a bit line in the substrate adjacent to the component stack, and an electrically conductive layer is positioned over the component stack and the oxide layer.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: March 22, 2005
    Assignee: Macronix International Co., Ltd.
    Inventors: Fu-Shiung Hsu, Chen-Chin Liu
  • Publication number: 20040262664
    Abstract: A disclosed method for forming a non-volatile memory cell includes forming a component stack including an electron trapping layer on a substrate surface. A dielectric layer is formed over the component stack, and a portion is removed such that a remainder of the dielectric layer exists substantially along sidewalls of the component stack. An oxide layer is formed over a bit line in the substrate adjacent to the component stack, and an electrically conductive layer is formed over the component stack and the oxide layer. A described non-volatile memory cell includes a component stack on a substrate surface, the component stack including an electron trapping layer. Multiple dielectric spacers are positioned along sidewalls of the component stack. An oxide layer is positioned over a bit line in the substrate adjacent to the component stack, and an electrically conductive layer is positioned over the component stack and the oxide layer.
    Type: Application
    Filed: June 27, 2003
    Publication date: December 30, 2004
    Inventors: Fu-Shiung Hsu, Chen-Chin Liu