Abstract: The present invention relates to the field of biomedicine, and in particular to a use of goji glycopeptide in the preparation of a drug for preventing and/or treating amyotrophic lateral sclerosis. Experimental results prove the use of goji glycopeptide in the preparation of a drug for preventing and/or treating amyotrophic lateral sclerosis.

Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: A semiconductor device includes a first diode, a second diode, a clamp circuit and a third diode. The first diode is coupled between an input/output (I/O) pad and a first voltage terminal. The second diode is coupled with the first diode, the I/O pad and a second voltage terminal. The clamp circuit is coupled between the first voltage terminal and the second voltage terminal. The second diode and the clamp circuit are configured to direct a first part of an electrostatic discharge (ESD) current flowing between the I/O pad and the first voltage terminal. The third diode, coupled to the first voltage terminal, and the second diode include a first semiconductor structure configured to direct a second part of the ESD current flowing between the I/O pad and the first voltage terminal.

Abstract: A dual-band antenna module includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports, and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feeding pin. The conductive metal layer is disposed on the first insulating substrate. The grounding supports are configured for supporting the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer and the bottom metal layer are respectively disposed on a top side and a bottom side of the second insulating substrate. The first frequency band signal transmitted or received by the first antenna structure is smaller than the second frequency band signal transmitted or received by the second antenna structure.

Abstract: An electrostatic discharge (ESD) circuit includes a first ESD detection circuit, a first discharging circuit and a first ESD assist circuit. The first ESD detection circuit is coupled between a first node having a first voltage and a second node having a second voltage. The first discharging circuit includes a first transistor. The first transistor has a first gate, a first drain, a first source and a first body terminal. The first gate is coupled to the first ESD detection circuit by a third node. The first drain is coupled to the first node. The first source and the first body terminal are coupled together at the second node. The first ESD assist circuit is coupled between the second and third node, and configured to clamp a third voltage of the third node at the second voltage during an ESD event at the first or second node.

Abstract: A driving circuit includes a first transistor, a capacitor, a second transistor, and a driving transistor. The first transistor is configured to provide a data signal according to a first scan signal. The capacitor is coupled to the first transistor, and the capacitor includes a first terminal and a second terminal. The second transistor is coupled to the first transistor, and the second transistor is configured to provide a start signal according to the data signal. The driving transistor is coupled to the second transistor, and the driving transistor is configured to output a driving signal according to the start signal.

Abstract: In some embodiments, a semiconductor device is provided, including a first doped region of a first conductivity type configured as a first terminal of a first diode, a second doped region of a second conductivity type configured as a second terminal of the first diode, wherein the first and second doped regions are coupled to a first voltage terminal; a first well of the first conductivity type surrounding the first and second doped regions in a layout view; a third doped region of the first conductivity type configured as a first terminal, coupled to an input/output pad, of a second diode; and a second well of the second conductivity type surrounding the third doped region in the layout view. The second and third doped regions, the first well, and the second well are configured as a first electrostatic discharge path between the I/O pad and the first voltage terminal.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A conductive bump structure of a circuit board includes at least one composite conductive bump formed in at least one bump preservation region on a conductive layer of the circuit board. The composite conductive bump includes a raised portion and a conductive pillar. The raised portion is raised from a top surface of the conductive layer by a height. A bottom of the conductive pillar is in contact with and is combined with a curved top surface of the raised portion, and a top of the conductive pillar is raised upwards to protrude beyond the top planar surface of the conductive layer by a protrusion height.

Abstract: A semiconductor package includes a semiconductor die, an encapsulant, a first and second dielectric layer, a through via, an extension pad, and a routing via. The semiconductor die includes a contact post. The first dielectric layer extends on the encapsulant. The through via extends through the first dielectric layer and has one end contacting the contact post. The extension pad is disposed on the first dielectric layer, contacting an opposite end of the through via with respect to the contact post. The extension pad has an elongated shape, a first end of the extension pad overlaps with the contact post and the through via, and a second end of the extension pad overlaps with the encapsulant. The second dielectric layer is disposed on the first dielectric layer and the extension pad. The routing via extends through the second dielectric layer to contact the second end of the extension pad.

Abstract: A golf club head includes a club head main body, a club head complementary component, and a protection component. The club head main body defines an opening which includes an inner opening section and an outer opening section spatially connected to and located outside the inner opening section. The club head complementary component is disposed in the inner opening section and connected to the club head main body. The protection component is disposed in the outer opening section and connected to the club head complementary component to cover the club head complementary component. The protection component is made of a carbon fiber impregnated with thermoplastic polyurethane, and has a Shore D hardness ranging from 40 to 70.

Abstract: A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.

Abstract: An electrical connector and a transmission wafer thereof are provided. The transmission wafer includes an insulating frame, a plurality of signal terminals and ground terminals fixed on the insulating frame, and a shielding sheet that is assembled to the insulating frame. Each of the signal terminals includes a signal contacting segment protruding from the insulating frame. Each of the ground terminals includes a ground contacting segment having a ground contact and protruding from the insulating frame. The shielding sheet includes a sheet body and a plurality of outer fixing arms extending from the sheet body. Each of the outer fixing arms corresponds in position to one of the ground contacting segments along a first direction. A free end portion of each of the outer fixing arms protrudes from the ground contact of the corresponding ground contacting segment along an insertion direction that is perpendicular to the first direction.

Abstract: A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.

Abstract: A golf club head includes a main body and a plate member disposed on the main body. The plate member includes a plurality of carbon fiber layers which are stacked on each other and are impregnated with a thermoset carbon fiber resin containing carbon nanotubes. The carbon nanotubes are present in an amount ranging from 0.01 wt% to 5 wt%, based on the total weight of the thermoset carbon fiber resin.

Abstract: The disclosure relates to a connector for fitting with a docking connector comprising an electrical module plug and additional module plugs, the connector comprising a housing having a front wall, a rear wall and two opposite side walls connecting the front wall and the rear wall, the housing comprising a first receiving portion concavely provided with a socket from the front wall toward the rear wall of the housing for receiving the electrical module plug of the docking connector and a second receiving portion provided on the front wall for receiving the additional module plugs of the docking connector.

Abstract: The disclosure relates to a conductive housing for the connector and a connector comprising the conductive housing. The conductive housing comprises a plurality of side surfaces, at least one of which comprising a plurality of terminal connection portions spaced apart from one another at an edge portion of the side surface, and a gap being formed between two adjacent terminal connection portions; and a plurality of terminal pins, each of which being connected to the respective terminal connection portion. The conductive housing further comprises at least one conductive elastic piece, one of which being connected between the two adjacent terminal connection portions to at least partially cover the gap between the two adjacent terminal connection portions.

Abstract: A golf club head includes a club head main body and a crown. The club head main body includes a main portion, and a receiving portion connected to the main portion. The main portion has an outer shell surface, and an upright side wall surface interconnecting the outer shell surface and the receiving portion. The crown includes a covering portion, and a protrusion protruding upwardly from an outer periphery of the covering portion, adjoining the side wall surface, and having a to-be-ground surface flushing with the outer shell surface. A height difference between the protrusion and the covering portion prevents the covering portion from being ground.