Abstract: A semiconductor package and the method of forming the same are provided. The semiconductor package may include a substrate, an integrated circuit package component having a semiconductor die bonded to the substrate, and a ring structure on the substrate, wherein the ring structure may encircle the integrated circuit package component in a top-down view. The ring structure may comprise a first attached segment, a second attached segment attached to the substrate by an adhesive, and a first suspended segment between the first attached segment and the second attached segment. The first suspended segment may be suspended over the substrate. The first attached segment and the second attached segment may be spaced apart from the package component by a first distance and a second distance, respectively. The first suspended segment may be spaced apart from the package component by a third distance different from the first distance and the second distance.

Abstract: A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.

Abstract: A contact height adjustment structure for a flexible circuit board is provided for making a plurality of conductive zones on a first surface of the flexible circuit board in tight contact engagement with corresponding contact points of a circuit device. The flexible circuit board is provided, on a second surface opposite to the first surface, with a plurality of height adjustment pads that are arranged at intervals and correspond, in a one-to-one manner, to the plurality of conductive zones. The plurality of height adjustment pads provide the plurality of conductive zones with a pushing force toward the corresponding contact points of the circuit device, so as to adjust a contact height of the conductive zones and to achieve an effect of setting the conductive zones in tight contact engagement with the corresponding contact points.

Abstract: The disclosure relates to a connector for fitting with a docking connector comprising an electrical module plug and additional module plugs, the connector comprising a housing, the housing comprising a first receiving portion concavely provided with a socket from the front wall toward the rear wall of the housing and a second receiving portion provided on the front wall. The connector further comprises a terminal comprising a terminal head portion and a terminal connecting portion which are connected to each other, the terminal head portion being bent at an angle with respect to the terminal connecting portion, such that the terminal head portion is provided in the second receiving portion for connecting to the additional module plugs and the terminal connecting portion is provided on an outer surface of one of the two side walls. The connector can be compatible with additional applications while being suitable for standard applications.

Abstract: A metal electrode of a ceramic capacitor and a method of forming the same are provided. The method includes mixing metal powders and a barium titanate organic-precursor to obtain precursor powders; adding an adhesive to the precursor powders to obtain a metal slurry; performing a molding process to the metal slurry to obtain a film material; performing a binder burn-out process to the film material to obtain a degumming film; and performing a sintering process to the degumming film to obtain the metal electrode. By mixing specific amount of barium titanate organic-precursor with the metal powders, the barium titanate metallic organic-precursor can be transformed to barium titanate in the following process, and barium titanate can be dispersed between the metals homogeneously. Therefore, electrode continuity can be increased.

Abstract: The disclosure relates to a conductive housing for the connector and a connector comprising the conductive housing. The conductive housing comprises a plurality of side surfaces, at least one of which comprising a plurality of terminal connection portions spaced apart from one another at an edge portion of the side surface, and a gap being formed between two adjacent terminal connection portions; and a plurality of terminal pins, each of which being connected to the respective terminal connection portion. The conductive housing further comprises at least one conductive elastic piece, one of which being connected between the two adjacent terminal connection portions to at least partially cover the gap between the two adjacent terminal connection portions. By means of such arrangement, the conductive elastic piece covers most areas between the terminal pins so as to enhance electromagnetic compatibility.

Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A conductive bump structure of a circuit board includes at least one composite conductive bump formed in at least one bump preservation region on a conductive layer of the circuit board. The composite conductive bump includes a raised portion and a conductive pillar. The raised portion is raised from a top surface of the conductive layer by a height. A bottom of the conductive pillar is in contact with and is combined with a curved top surface of the raised portion, and a top of the conductive pillar is raised upwards to protrude beyond the top planar surface of the conductive layer by a protrusion height.

Abstract: A semiconductor package includes a semiconductor die, an encapsulant, a first and second dielectric layer, a through via, an extension pad, and a routing via. The semiconductor die includes a contact post. The first dielectric layer extends on the encapsulant. The through via extends through the first dielectric layer and has one end contacting the contact post. The extension pad is disposed on the first dielectric layer, contacting an opposite end of the through via with respect to the contact post. The extension pad has an elongated shape, a first end of the extension pad overlaps with the contact post and the through via, and a second end of the extension pad overlaps with the encapsulant. The second dielectric layer is disposed on the first dielectric layer and the extension pad. The routing via extends through the second dielectric layer to contact the second end of the extension pad.

Abstract: A golf club head includes a club head main body, a club head complementary component, and a protection component. The club head main body defines an opening which includes an inner opening section and an outer opening section spatially connected to and located outside the inner opening section. The club head complementary component is disposed in the inner opening section and connected to the club head main body. The protection component is disposed in the outer opening section and connected to the club head complementary component to cover the club head complementary component. The protection component is made of a carbon fiber impregnated with thermoplastic polyurethane, and has a Shore D hardness ranging from 40 to 70.

Abstract: A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.

Abstract: An electrical connector and a transmission wafer thereof are provided. The transmission wafer includes an insulating frame, a plurality of signal terminals and ground terminals fixed on the insulating frame, and a shielding sheet that is assembled to the insulating frame. Each of the signal terminals includes a signal contacting segment protruding from the insulating frame. Each of the ground terminals includes a ground contacting segment having a ground contact and protruding from the insulating frame. The shielding sheet includes a sheet body and a plurality of outer fixing arms extending from the sheet body. Each of the outer fixing arms corresponds in position to one of the ground contacting segments along a first direction. A free end portion of each of the outer fixing arms protrudes from the ground contact of the corresponding ground contacting segment along an insertion direction that is perpendicular to the first direction.

Abstract: A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.

Abstract: A golf club head includes a main body and a plate member disposed on the main body. The plate member includes a plurality of carbon fiber layers which are stacked on each other and are impregnated with a thermoset carbon fiber resin containing carbon nanotubes. The carbon nanotubes are present in an amount ranging from 0.01 wt% to 5 wt%, based on the total weight of the thermoset carbon fiber resin.

Abstract: The disclosure relates to a conductive housing for the connector and a connector comprising the conductive housing. The conductive housing comprises a plurality of side surfaces, at least one of which comprising a plurality of terminal connection portions spaced apart from one another at an edge portion of the side surface, and a gap being formed between two adjacent terminal connection portions; and a plurality of terminal pins, each of which being connected to the respective terminal connection portion. The conductive housing further comprises at least one conductive elastic piece, one of which being connected between the two adjacent terminal connection portions to at least partially cover the gap between the two adjacent terminal connection portions.

Abstract: The disclosure relates to a connector for fitting with a docking connector comprising an electrical module plug and additional module plugs, the connector comprising a housing having a front wall, a rear wall and two opposite side walls connecting the front wall and the rear wall, the housing comprising a first receiving portion concavely provided with a socket from the front wall toward the rear wall of the housing for receiving the electrical module plug of the docking connector and a second receiving portion provided on the front wall for receiving the additional module plugs of the docking connector.

Abstract: A golf club head includes a club head main body and a crown. The club head main body includes a main portion, and a receiving portion connected to the main portion. The main portion has an outer shell surface, and an upright side wall surface interconnecting the outer shell surface and the receiving portion. The crown includes a covering portion, and a protrusion protruding upwardly from an outer periphery of the covering portion, adjoining the side wall surface, and having a to-be-ground surface flushing with the outer shell surface. A height difference between the protrusion and the covering portion prevents the covering portion from being ground.

Abstract: A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.

Abstract: An electrical connector and a transmission wafer thereof are provided. The transmission wafer includes an insulating frame, a plurality of signal terminals and ground terminals fixed on the insulating frame, and a shielding sheet that is assembled to the insulating frame. Each of the signal terminals includes a signal contacting segment protruding from the insulating frame. Each of the ground terminals includes a ground contacting segment having a ground contact and protruding from the insulating frame. The shielding sheet includes a sheet body and a plurality of outer fixing arms extending from the sheet body. Each of the outer fixing arms corresponds in position to one of the ground contacting segments along a first direction. A free end portion of each of the outer fixing arms protrudes from the ground contact of the corresponding ground contacting segment along an insertion direction that is perpendicular to the first direction.