Abstract: Provided is a substrate structure including a substrate body, electrical contact pads and an insulating protection layer disposed on the substrate body, wherein the insulating protection layer has openings exposing the electrical contact pads, and at least one of the electrical contact pads has at least a concave portion filled with a filling material to prevent solder material from permeating along surfaces of the insulating protection layer and the electric contact pads, thereby eliminating the phenomenon of solder extrusion. Thus, bridging in the substrate structure can be eliminated even when the bump pitch between two adjacent electrical contact pads is small. As a result, short circuits can be prevented, and production yield can be increased.

Abstract: A peeling apparatus includes a peel body and a ceramic blade unit. The peel body has a handgrip part and two carrier arms extending from a distal end of the handgrip part. The ceramic blade unit has two opposite sides connected pivotally to the carrier arms, an inner cutting edge and an outer blunt edge extending between the opposite sides so as to expose the outer blunt edge to an exterior thereof. The inner cutting edge is used for peeling an external surface of fruit and vegetable, and the outer blunt edge is easy shoveled off waste resulted from peeling operation of the inner cutting edge.