Abstract: A polishing pad conditioner for a chemical mechanical polishing apparatus and real-time monitoring method thereof. A conditioning head is supported for rotation at one end of a transverse beam. A drive assembly is coupled to the conditioning head to drive downward force to the conditioning head, and at least one sensor disposed on the transverse beam detects deflection of the transverse beam.

Abstract: A polishing pad conditioner for a chemical mechanical polishing apparatus and real-time monitoring method thereof. A conditioning head is supported for rotation at one end of a transverse beam. A drive assembly is coupled to the conditioning head to drive downward force to the conditioning head, and at least one sensor disposed on the transverse beam detects deflection of the transverse beam.

Abstract: A novel apparatus and method for calibrating the gap distance between adjacent scrubber brushes with the frictional force of the brushes against a wafer, is disclosed. The apparatus includes a support frame, at least one pair of load cells carried by the support frame, at least one test plate operably engaging the load cells, and at least one electronic indicator operably connected to the load cells, respectively, for indicating a force exerted on the load cells by the test plate. The method includes placing at least one test plate between the adjacent scrubber brushes, rotating the scrubber brushes against the test plate, determining the frictional force of each brush against the plate, and adjusting the gap distance between the brushes to obtain a desired frictional force for the scrubber cleaning of production wafers.