Abstract: A scraper device is applied to a solder paste printer for scraping solder paste on a surface of a stencil. The scraper device comprises a supporting structure, a scraper fixed to the supporting structure, two blocking members positioned at opposite ends of the scraper respectively and coupled to the supporting structure, and two adjusting structures moveably mount the two blocking members to the supporting structure correspondingly. When the scraper scrapes the solder paste, the scraper and the two blocking members are slid on the surface of the stencil, the adjusting structure adjusts a friction between each blocking member and the surface to a predetermined level.