Patents by Inventor Fu-Wei Chan

Fu-Wei Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure and manufacturing method thereof
    Patent number: 12389727
    Abstract: A package structure includes a circuit substrate, a light emitting diode array, a first encapsulant, and a sealant. The circuit substrate includes a top surface and a side surface of the circuit substrate. The light emitting diode array is disposed on the top surface of the circuit substrate. The first encapsulant is disposed above the circuit substrate. The first encapsulant includes a main portion and an extension portion, in which the main portion of the first encapsulant is disposed parallel to the top surface of the circuit substrate, and the extension portion of the first encapsulant extends to the side surface of the circuit substrate. The sealant is disposed below the extension portion of the first encapsulant, and the sealant contacts the first encapsulant and the circuit substrate. The first encapsulant and the sealant together form a coplanar surface.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: August 12, 2025
    Assignee: AUO CORPORATION
    Inventors: Fu-Wei Chan, Kuan-Hsun Chen, Yi-Hsin Lin
  • Display panel including opaque encapsulation and doped planarization layers and manufacturing method thereof
    Patent number: 12322735
    Abstract: A display panel includes a substrate, light-emitting diodes, and a cured opaque encapsulant layer. The light-emitting diodes are disposed on a first surface of the substrate. The cured opaque encapsulant layer is disposed on the first surface and a side surface of the substrate, and surrounds the light emitting diodes. A second surface of the cured opaque encapsulant layer facing away from the substrate is a rough surface.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: June 3, 2025
    Assignee: Au Optronics Corporation
    Inventors: Fu-Wei Chan, Kuan-Hsun Chen, Yi-Yueh Hsu
  • PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20230246142
    Abstract: A package structure includes a circuit substrate, a light emitting diode array, a first encapsulant, and a sealant. The circuit substrate includes a top surface and a side surface of the circuit substrate. The light emitting diode array is disposed on the top surface of the circuit substrate. The first encapsulant is disposed above the circuit substrate. The first encapsulant includes a main portion and an extension portion, in which the main portion of the first encapsulant is disposed parallel to the top surface of the circuit substrate, and the extension portion of the first encapsulant extends to the side surface of the circuit substrate. The sealant is disposed below the extension portion of the first encapsulant, and the sealant contacts the first encapsulant and the circuit substrate. The first encapsulant and the sealant together form a coplanar surface.
    Type: Application
    Filed: December 7, 2022
    Publication date: August 3, 2023
    Inventors: Fu-Wei CHAN, Kuan-Hsun CHEN, Yi-Hsin LIN
  • DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
    Publication number: 20230187417
    Abstract: A display panel includes a substrate, light-emitting diodes, and a cured opaque encapsulant layer. The light-emitting diodes are disposed on a first surface of the substrate. The cured opaque encapsulant layer is disposed on the first surface and a side surface of the substrate, and surrounds the light emitting diodes. A second surface of the cured opaque encapsulant layer facing away from the substrate is a rough surface.
    Type: Application
    Filed: April 1, 2022
    Publication date: June 15, 2023
    Applicant: Au Optronics Corporation
    Inventors: Fu-Wei Chan, Kuan-Hsun Chen, Yi-Yueh Hsu
  • Fullerene derivatives and optoelectronic devices utilizing the same
    Patent number: 8741448
    Abstract: Disclosed is a fullerene derivative having a formula of F-Cy, wherein F is an open-cage fullerene, and Cy is a chalcogenyl group. The fullerene derivative can be applied to hydrogen storage material and an optoelectronic device such as an organic light emitting diode (OLED), a solar cell, or an organic thin film transistor (TFT).
    Type: Grant
    Filed: August 9, 2011
    Date of Patent: June 3, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Ping Chen, Yeu-Ding Chen, Shih-Ching Chuang, Yu-Wei Lin, Fu-Wei Chan
  • FULLERENE DERIVATIVES AND OPTOELECTRONIC DEVICES UTILIZING THE SAME
    Publication number: 20120305919
    Abstract: Disclosed is a fullerene derivative having a formula of F-Cy, wherein F is an open-cage fullerene, and Cy is a chalcogenyl group. The fullerene derivative can be applied to hydrogen storage material and an optoelectronic device such as an organic light emitting diode (OLED), a solar cell, or an organic thin film transistor (TFT).
    Type: Application
    Filed: August 9, 2011
    Publication date: December 6, 2012
    Inventors: Chih-Ping CHEN, Yeu-Ding Chen, Shih-Ching Chuang, Yu-Wei Lin, Fu-Wei Chan