Patents by Inventor Fu-Wei Dai

Fu-Wei Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7780471
    Abstract: A connector apparatus includes a main body. The main body includes a first module, and a second module. The first and second modules are detachably assembled together. At least one connector is fixed in each of the first and second modules.
    Type: Grant
    Filed: December 25, 2008
    Date of Patent: August 24, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Hsiang Hung, Lei Shen, Yong-Hua Xiao, Fu-Wei Dai, Zhen-Xing Wu
  • Publication number: 20100136847
    Abstract: A connector apparatus includes a main body. The main body includes a first module, and a second module. The first and second modules are detachably assembled together. At least one connector is fixed in each of the first and second modules.
    Type: Application
    Filed: December 25, 2008
    Publication date: June 3, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO.,LTD, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WEN-HSIANG HUNG, LEI SHEN, YONG-HUA XIAO, FU-WEI DAI, ZHEN-XING WU