Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.

Abstract: A thin-film magnetic recording media is prepared which contains a carbon overcoat sputtered on a magnetic recording layer. The carbon overcoat is sputtered on the magnetic recording layer using a sputtering process which is conducted in a sputtering chamber having an inert gas and a mixture of nitrogen gas and hydrogen gas, wherein said nitrogen gas and hydrogen gas are provided at a mole ratio of nitrogen/hydrogen between about 0.5 and about 1. The hydrogen and nitrogen doped amorphous carbon overcoat exhibits excellent mechanical properties and tribological performance.