Patents by Inventor Fu Xing Chan

Fu Xing Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12324102
    Abstract: A semiconductor storage device such as an SSD includes a pliable printed circuit board (PCB) having semiconductor memory devices mounted by solder balls on first and second opposed major surfaces. The memory devices are mounted so as to be staggered and/or partially overlapping with each other on the first and second surfaces of the PCB in at least one direction. The staggered arrangement allows the PCB to flex upon warping of the memory devices mounted on the PCB.
    Type: Grant
    Filed: July 17, 2023
    Date of Patent: June 3, 2025
    Assignee: Sandisk Technologies, Inc.
    Inventors: Fu Xing Chan, Chun Sean Lau, Bo Yang
  • Publication number: 20240397624
    Abstract: A snap-fit connector electrically and mechanically couples a first circuit board to a second circuit board. A first portion of the snap-fit connector is positioned on or within the first circuit board. The first portion of the snap-fit connector is electrically coupled to a trace associated with an electronic component on the first circuit board. A through-hole defined by the second circuit board is removably coupled to a top portion of the snap-fit connector. The through-hole on the second circuit board is electrically coupled to a trace of an electronic component provided on the second circuit board. Thus, the snap-fit connector electrically couples the electronic component on the first circuit board with the electronic component on the second circuit board.
    Type: Application
    Filed: July 28, 2023
    Publication date: November 28, 2024
    Inventors: Tew Wei Hong, Beng Gian Ooi, Fu Xing Chan
  • Publication number: 20240381524
    Abstract: A shock absorber for a printed circuit board (PCB) includes a first portion and a second portion. The first portion is positioned on a first side of the PCB at or near a connector that extends from the PCB. The second portion is positioned on a second side of the PCB, opposite the first portion. The first and second portions prevent the PCB from moving when the PCB is coupled to a host device. As the PCB is subjected to various movements, strains and stresses, the shock absorber prevents the PCB from cracking or breaking, especially at or near the connector, which is susceptible to cracking and breaking.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 14, 2024
    Inventors: MyungJin Kim, Fu Xing Chan, Chun Sean Lau, Lihwa Fong
  • Publication number: 20240260194
    Abstract: A semiconductor storage device such as an SSD includes a pliable printed circuit board (PCB) having semiconductor memory devices mounted by solder balls on first and second opposed major surfaces. The memory devices are mounted so as to be staggered and/or partially overlapping with each other on the first and second surfaces of the PCB in at least one direction. The staggered arrangement allows the PCB to flex upon warping of the memory devices mounted on the PCB.
    Type: Application
    Filed: July 17, 2023
    Publication date: August 1, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Fu Xing Chan, Chun Sean Lau, Bo Yang
  • Patent number: 11022086
    Abstract: An insulator for a corona igniter, referred to as a barrier discharge ignition (BDI) device, for use in an internal combustion engine, is provided. A central electrode is disposed in a slot of the insulator and an electrode tip is spaced from a round insulator tip by insulating material. A shell formed of metal surrounds a portion of the insulator. The insulator has a thickness tapering between a shell firing surface and the insulator tip. The tapering insulator thickness is unidirectional and thus does not increase between a start of the taper and the insulator tip. A method of manufacturing an insulator for a corona igniter is also provided. Equations can be used to determine if a taper in the insulator thickness is needed to encourage corona propagation along a core nose projection of the insulator, and if so, the location and size of the taper.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: June 1, 2021
    Assignee: Tenneco Inc.
    Inventors: John Antony Burrows, Fu Xing Chan, James D. Lykowski
  • Publication number: 20200124017
    Abstract: An insulator for a corona igniter, referred to as a barrier discharge ignition (BDI) device, for use in an internal combustion engine, is provided. A central electrode is disposed in a slot of the insulator and an electrode tip is spaced from a round insulator tip by insulating material. A shell formed of metal surrounds a portion of the insulator. The insulator has a thickness tapering between a shell firing surface and the insulator tip. The tapering insulator thickness is unidirectional and thus does not increase between a start of the taper and the insulator tip. A method of manufacturing an insulator for a corona igniter is also provided. Equations can be used to determine if a taper in the insulator thickness is needed to encourage corona propagation along a core nose projection of the insulator, and if so, the location and size of the taper.
    Type: Application
    Filed: October 17, 2019
    Publication date: April 23, 2020
    Inventors: John Antony Burrows, Fu Xing Chan, James D. Lykowski