Abstract: An electronic device enclosure includes a rear panel and a blocking board. The rear panel comprises a front surface and a back surface opposite to the front surface. A through opening is defined in the rear panel. The blocking board comprises a main body, a first flange and a second flange opposite to the first flange. A first stopping piece is extends from the first flange. A second stopping piece is extended from the second flange. A latch portion is located on the first flange. A first protrusion is located on the second flange. The latch portion and the second protrusion extend through the through opening by being elastically deformed, the latch portion and the second protrusion abut on the front surface, and the first stopping piece and the second stopping piece abut on the back surface.

Abstract: A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area.

Abstract: An electronic device includes a cage and a fan module. The cage includes a mounting plate defining a ventilation hole. A positioning portion is located in the ventilation hole. A restriction is located on an inner surface of the positioning portion. The height of the restriction is such as to strictly require the fan module to be in the correct orientation when it is fitted to the electronic device.

Abstract: A connector includes a body and a socket extending from the body. A blocking wall is located on the body. The socket includes a top wall, a resilient piece located on the top wall. The blocking wall is surrounded the resilient piece for preventing the resilient piece from destroying.

Abstract: A connector assembly includes a first connector and a second connector. The first connector includes a concave slot and a protruding portion adjacent to the concave slot. The second connector includes a resisting member and a receiving slot adjacent to the resisting member. The resisting member is engaged in the concave slot, for preventing the first connector from moving relative to the second connector in a first direction; and the protruding portion is engaged in the receiving slot, for preventing the first connector from moving relative to the second connector in a second direction opposite to the first direction.

Abstract: An enclosure includes a chassis and a bracket. The chassis includes a bottom panel, a rear panel and a side panel. The rear panel defines a latch hole. Two clamping pieces are located on the side panel. The bracket is engaged between the clamping pieces and includes a first sidewall and a second sidewall. A second hook and a resilient piece are located on the first sidewall. A first hook is located on the second sidewall. The first hook and the second hook are separately engaged with the two clamping pieces for preventing the bracket from moving along a first direction near to the bottom panel. The resilient piece is engaged in the latch hole to preventing the bracket from moving a second direction opposite to the first direction, and the resilient piece is elastically deformable to disengage from the latch hole.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes.

Abstract: An expansion card mounting apparatus including an enclosure, the enclosure including a support plate and a flange, the enclosure defining a slot, the support plate and the flange located above the slot; a mounting plate, the mounting plate including a mounting plate body and a bent portion extending from the mounting plate body; the mounting plate body securing an expansion card and covering the slot; the bent portion located on the support plate; a securing element, the securing element pressing the bent portion; and a pressing member, the pressing member including a resilient arm and a securing portion extending from the resilient arm; the resilient arm including a first and a second ends, the first end resisting the expansion card; the second end resisting on the securing element; and the securing portion engaging with the flange to enable the pressing member sandwiched between the securing element and the flange.

Abstract: An electronic device comprises a cooler comprises a plurality of first locking members, a backboard defining pluralities of first and second positioning holes, and a circuit board. The backboard is attached to the cooler through the first locking members engaged with the second positioning holes. A first mounting member and a second mounting member are adapted to receive the heat generating component. The first mounting member defines a plurality of locking holes. The first positioning holes are among the second positioning holes. The second mounting member receives the heat generating component, the circuit board is between the second mounting member and the backboard, the first mounting member is secured to the circuit board; when the first mounting member receives the heat generating component, the circuit board is between the first mounting member and the backboard, the first mounting member is secured to the backboard.

Abstract: A linear vibration device is disclosed. The linear vibration device includes a housing, a plurality of elastic members received in the housing, each of the elastic member has a fastening portion connecting to the housing, an elastic arm extending from the fastening portion, and a mounting portion extending from the elastic arm, a moving unit suspended in the housing by the elastic members, a coil located below the moving unit, a supporting portion coupling to the elastic member, the supporting portion has a supporting plate covering at least a part of a top surface of the moving unit and a supporting arm extending downwardly from the supporting plate for pushing the mounting portion toward the positioning portion of the moving unit, the mounting portion has a fender defining a top part above the top surface of the moving unit for restricting the position of the supporting plate.

Abstract: A computing device includes a first motherboard and a second motherboard perpendicularly attached to the first motherboard. The first motherboard includes a first CPU module and a plurality of first peripheral component interconnect (PCI) sockets. The second motherboard includes a second CPU module and a plurality of second PCI sockets. The plurality of first PCI sockets is located perpendicularly to both motherboards. The plurality of second PCI sockets includes at least one PCI socket that is obliquely oriented relative to the first motherboard.

Abstract: A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance.

Abstract: A mounting apparatus for mounting a data storage device, includes a drive bracket and a slider mounted on the data storage device. The drive bracket includes a side piece in which a sliding groove is located. The sliding groove includes a first end and a second end. The second end is adjacent to an edge of the side piece. The first end is located on the side piece. A guiding surface is located at the first end. The guiding surface inclines from an inner surface of the side piece to an outer surface of the side piece. The slider slides in the sliding groove from the second end to the first end. The slider abuts the guiding surface. The guiding surface retains the slider at the first end.

Abstract: A heat dissipating apparatus includes a first fan and a second fan. A clipping portion with a block is located on the first fan. A receiving hole is defined in the second fan, and two first retaining panels and a second retaining panel extend from the second fan. The two first retaining panels are substantially parallel to each other and perpendicular to the second retaining panel. The clipping portion is located between the two retaining panels and abuts the first retaining panel, and the block is engaged in the receiving hole.

Abstract: A heat dissipating assembly includes a heat exchanger and a base. The heat exchanger defines at least one latching slot. A touching piece is surrounded the latching slot. The base includes at least one latching post. The touching piece is resiliently deformable to engage the at least one latching post in the at least one latching slot. The touching piece abuts the at least one latching post.

Abstract: An input/output (I/O) connector assembly includes an I/O connector module and a holder for accommodating the I/O connector module. The I/O connector module includes a plurality of I/O connectors and an Electro Magnetic Interference (EMI) shielding member located below each of the plurality of I/O connectors. The EMI shielding member includes a flat piece, a first resilient piece extending slantingly upwards from the flat piece, and a second resilient piece extending slantingly downward from the flat piece. A plurality of receiving holes is defined in the holder. The plurality of I/O connecters extends through and protrudes out from the plurality of receiving holes. The first resilient piece abuts a corresponding one of the plurality of I/O connectors. The second resilient piece abuts the holder.

Abstract: A fan speed control circuit includes a first fan, a second fan, a first temperature sensor, a second temperature sensor, a PWM regulator, and a driving module. The first temperature sensor senses a temperature of the first component to generate a first temperature signal. The second temperature sensor senses a temperature of a second component to generate a second temperature signal. The PWM regulator is connected to the first temperature sensor and the second temperature sensor. The PWM regulator generates a first PWM signal according to the first temperature signal and generates a second PWM signal according to the second temperature signal. The driving module is connected to the PWM regulator. The driving module generates a first driving voltage provided to the first fan according to the first PWM signal. The driving module also generates a second driving voltage provided to the second fan according to the second PWM signal.

Abstract: A mounting assembly includes a circuit board, a securing member and a heat dissipating device. A retainer is located on the circuit board. The securing member includes a positioning portion and a claw connected to the positioning portion. The heat dissipating device includes a base attached to the circuit board and a number of fins perpendicularly located on the base. The number of fins defines a number of first air paths and a number of second air paths substantially perpendicular to the number of first air paths. The positioning portion is received in at least one of the number of first air paths and at least one of the number of second air paths, and the claw is engaged with the retainer.

Abstract: An electronic device includes a chassis and a bracket. An opening is defined in the chassis. The opening has a first side edge and a second side edge located at opposite sides thereof. A length of the second side edge is greater than that of the first side edge. The bracket is mounted in the opening. The bracket includes a pair of first hooks and a pair of second hooks at opposite sides thereof. A distance between the pair of first hooks corresponds to the length of the first side edge. A distance between the pair of second hooks corresponds to the length of the second side edge. The pair of first hooks is engaged into the opening along the first side edge. The pair of second hooks is engaged into the opening along the second side edge.

Abstract: A connector assembly includes a plug device and a socket device. The plug device includes a holding portion. The holding portion includes a top wall, a bottom wall opposite to the top wall, and an middle portion located between the top wall and the bottom wall. An inner surface of the top wall facing the middle portion defines a stopping hole. The socket device includes a main body and a resilient piece. The main body includes a top panel and a bottom panel opposite to the top panel. The resilient piece is located on the top panel. A latch portion is located on the resilient piece. The resilient piece is elastically deformable to engage the latch portion in the stopping hole. The main body is located between the top wall and the bottom wall. The middle portion is located on the top panel and the bottom panel.