Patents by Inventor Fu-Yang Chen
Fu-Yang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240194652Abstract: A light emitting device includes a light emitting diode package structure. The light emitting diode package structure includes a circuit structure, a plurality of light emitting diodes, and an encapsulation layer. The light emitting diodes are disposed on the circuit structure and electrically connected to the circuit structure. The encapsulation layer covers top surfaces and side surfaces of the light emitting diodes and a side surface of the circuit structure.Type: ApplicationFiled: December 22, 2022Publication date: June 13, 2024Applicant: AUO CorporationInventors: Hao-Lun Hsieh, Shuo-Yang Sun, Fu-Yang Chen, Xiao-Yun Li, Yu-Hao Chang, Jhih-Jhu Jhan
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Patent number: 11678441Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.Type: GrantFiled: November 18, 2020Date of Patent: June 13, 2023Assignee: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Chien-Chou Chen, Fu-Yang Chen, Ra-Min Tain
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Publication number: 20230064560Abstract: A light emitting diode (LED) package structure includes a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, an LED element, and a solder material. The first conductive pattern has a first portion and a second portion, the first portion fills a through hole of the first insulating layer, and the second portion is disposed on the first insulating layer. The second insulating layer is disposed on the first insulating layer and covers the first conductive pattern. The second portion of the first conductive pattern is sandwiched between the first insulating layer and the second insulating layer. The second conductive pattern is disposed on the second insulating layer and is electrically connected to the first conductive pattern. The LED element is bonded to the second conductive pattern. The solder material is disposed on the first portion of the first conductive pattern.Type: ApplicationFiled: August 23, 2022Publication date: March 2, 2023Applicant: AUO CorporationInventors: Shuo-Yang Sun, Hao-Lun Hsieh, Xiao-Yun Li, Yu-Hao Chang, Fu-Yang Chen, Jhih-Jhu Jhan, Yu-Chih Wang, Ying-Hui Lai
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Publication number: 20210282277Abstract: A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided.Type: ApplicationFiled: May 10, 2021Publication date: September 9, 2021Applicant: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen
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Patent number: 11037869Abstract: A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.Type: GrantFiled: November 21, 2019Date of Patent: June 15, 2021Assignee: Unimicron Technology Corp.Inventors: Fu-Yang Chen, Chun-Hsien Chien, Cheng-Hui Wu, Wei-Ti Lin
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Patent number: 11032917Abstract: A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided.Type: GrantFiled: July 4, 2019Date of Patent: June 8, 2021Assignee: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen
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Patent number: 10950687Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.Type: GrantFiled: May 15, 2020Date of Patent: March 16, 2021Assignee: Unimicron Technology Corp.Inventors: Yu-Hua Chen, Fu-Yang Chen, Chun-Hsien Chien, Chien-Chou Chen, Wei-Ti Lin
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Publication number: 20210076508Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.Type: ApplicationFiled: November 18, 2020Publication date: March 11, 2021Applicant: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Chien-Chou Chen, Fu-Yang Chen, Ra-Min Tain
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Publication number: 20210057320Abstract: A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.Type: ApplicationFiled: November 21, 2019Publication date: February 25, 2021Inventors: Fu-Yang Chen, Chun-Hsien Chien, Cheng-Hui Wu, Wei-Ti Lin
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Patent number: 10886264Abstract: A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.Type: GrantFiled: May 8, 2020Date of Patent: January 5, 2021Assignee: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen
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Patent number: 10888001Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.Type: GrantFiled: January 10, 2019Date of Patent: January 5, 2021Assignee: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Chien-Chou Chen, Fu-Yang Chen, Ra-Min Tain
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Publication number: 20200273948Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.Type: ApplicationFiled: May 15, 2020Publication date: August 27, 2020Applicant: Unimicron Technology Corp.Inventors: Yu-Hua Chen, Fu-Yang Chen, Chun-Hsien Chien, Chien-Chou Chen, Wei-Ti Lin
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Publication number: 20200266181Abstract: A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.Type: ApplicationFiled: May 8, 2020Publication date: August 20, 2020Applicant: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen
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Patent number: 10700049Abstract: A light-emitting diode package structure includes a carrier, at least one self-assembled material layer, a first solder mask layer, and at least one light-emitting diode. The carrier includes a first build-up circuit. The self-assembled material layer is disposed on the first build-up circuit. The first solder mask layer is disposed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the self-assembled material layer. The light-emitting diode is disposed on the first build-up circuit. The light-emitting diode has a self-assembled pattern. The light-emitting diode is self-assembled into the opening of the first solder mask layer through a force between the self-assembled pattern and the self-assembled material layer. A manufacturing method of the light-emitting diode package structure is also provided.Type: GrantFiled: October 16, 2018Date of Patent: June 30, 2020Assignee: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen
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Patent number: 10700161Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.Type: GrantFiled: October 15, 2018Date of Patent: June 30, 2020Assignee: Unimicron Technology Corp.Inventors: Yu-Hua Chen, Fu-Yang Chen, Chun-Hsien Chien, Chien-Chou Chen, Wei-Ti Lin
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Publication number: 20200075564Abstract: A light-emitting diode package structure includes a carrier, at least one self-assembled material layer, a first solder mask layer, and at least one light-emitting diode. The carrier includes a first build-up circuit. The self-assembled material layer is disposed on the first build-up circuit. The first solder mask layer is disposed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the self-assembled material layer. The light-emitting diode is disposed on the first build-up circuit. The light-emitting diode has a self-assembled pattern. The light-emitting diode is self-assembled into the opening of the first solder mask layer through a force between the self-assembled pattern and the self-assembled material layer. A manufacturing method of the light-emitting diode package structure is also provided.Type: ApplicationFiled: October 16, 2018Publication date: March 5, 2020Applicant: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen
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Publication number: 20200075711Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.Type: ApplicationFiled: October 15, 2018Publication date: March 5, 2020Applicant: Unimicron Technology Corp.Inventors: Yu-Hua Chen, Fu-Yang Chen, Chun-Hsien Chien, Chien-Chou Chen, Wei-Ti Lin
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Publication number: 20190380211Abstract: A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided.Type: ApplicationFiled: July 4, 2019Publication date: December 12, 2019Applicant: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen
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Publication number: 20190380210Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.Type: ApplicationFiled: January 10, 2019Publication date: December 12, 2019Applicant: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Chien-Chou Chen, Fu-Yang Chen, Ra-Min Tain
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Patent number: 10123418Abstract: A circuit board structure including an insulating layer, first and second dielectric layers, and first and second inductors is provided. The insulating layer includes a first surface, a second surface, and a first conductive through hole. The first dielectric layer is disposed on the first surface. The first inductor is disposed on the first surface and includes a first conductive coil in a solenoid form penetrating the first dielectric layer and a first magnetic flux axis of which the direction is substantially parallel to the first surface. The second dielectric layer is disposed on the second surface. The second inductor is disposed on the second surface and includes a second conductive coil in a solenoid form penetrating the second dielectric layer and a second magnetic flux axis of which the direction is substantially parallel to the second surface. A manufacturing method of a circuit board structure is provided.Type: GrantFiled: February 23, 2018Date of Patent: November 6, 2018Assignee: Unimicron Technology Corp.Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen