Abstract: A semiconductor package structure having hollow chamber includes a bottom substrate having a bottom baseboard and a bottom metal layer formed on a disposing area of the bottom baseboard, a connection layer formed on the bottom metal layer, and a top substrate. The bottom metal layer has at least one corner having a first and a second outer lateral surface, and an outer connection surface. A first extension line is formed from a first extreme point of the first outer lateral surface, and a second extension line is formed from a second extreme point of the second outer lateral surface. A first exposing area of the bottom baseboard is formed by connecting the first and second extreme points and a cross point of the first and second extreme points. The top substrate connects to the connection layer to form a hollow chamber between the top and bottom substrates.

Abstract: A process for manufacturing a semiconductor package having a hollow chamber includes providing a bottom substrate having a bottom plate, a ring wall and a slot, wherein the ring wall and the bottom plate form the slot; forming an under ball metallurgy layer on a surface of the ring wall; bumping a plurality of solder balls on a surface of the under ball metallurgy layer, each of the solder balls comprises a diameter, wherein a spacing is spaced apart between two adjacent solder balls; performing reflow soldering to the solder balls for making the solder balls melting and interconnecting to form a connection layer; connecting a top substrate to the bottom substrate, wherein the lot of the bottom substrate is sealed by the top substrate to form a hollow chamber used for accommodating an electronic device.

Abstract: A color filter substrate for an in-cell optical touch display panel is provided, which includes a substrate, a visible-light shielding structure, a color filter layer and an infrared filter layer. The visible-light shielding structure is disposed on the substrate to define sub-pixel regions and touch sensor regions of the substrate. The color filter layer covers the sub-pixel regions. The infrared filter layer covers the touch sensor regions. The infrared filter layer is made of a single infrared-light permeable material, which has a light transmittance in infrared-light wavelength range greater than a light transmittance in visible-light wavelength range. An in-cell optical touch display panel including the color filter substrate and materials of the infrared filter layer are also provided.