Abstract: A circuit board assembly (100) includes a circuit board (10) and at least one electrical element (20). The circuit board includes a dielectric substrate (12) including a supporting surface (13), and at least one connecting part (14) formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media (28). At least one air-exhaust hole (16) extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media.

Abstract: A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module.

Abstract: An image sensor package is provided. The image sensor package includes a basic body, an image sensor chip, a carrier, and at least one passive component. The image sensor chip is electrically and structurally connected to the basic body, the image sensor package including a sensitive region. The carrier positioned on a supporting portion of the image sensor package spacially surrounding the sensitive region of the image sensor chip. The at least one passive component carried by the carrier and electrically connected to the basic body.

Abstract: A circuit board assembly includes a circuit board and at least one electrical element. The circuit board includes a dielectric substrate including a supporting surface, and at least one connecting part formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media. At least one air-exhaust hole extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media.

Abstract: A camera module (200) includes a lens module and a base (210) with a sensor installed thereon. The base is provided with at least two supporting protrusions (222) extending therefrom. Each protrusion is oriented the lens module, and the lens module is fixedly to and contacts with the at least two supporting protrusions. A colloid layer surrounding the sensor is sandwiched between the second end of the holder and the base. Electronic components are disposed on the circuit board and covered by the colloid layer.

Abstract: An electrical connector for electrical connecting a camera module with a circuit board includes an insulative casing and a number of signal terminals. The insulative casing includes a bottom wall and a number of side walls. A receiving space is defined between the bottom wall and side walls for receiving the camera module. The bottom wall defines a receiving opening thereon. The signal terminals are fixed on the side walls and extending beyond the bottom wall configured for electrically connecting with the camera module and the circuit board. The present invention also relates to a camera device having the same.

Abstract: An electrical socket for electrically connecting with a camera module includes a housing, a grounding spring embedded in the housing, a plurality of terminals received in the housing, and a pair of first shields in collaboration with a pair of second shields for substantially enclosing the housing, and a wire embedded in the housing for electrically connecting one of the first shields and the grounding spring. The grounding spring defines a second contacting portion for providing electrical connection between a corresponding ground pad of the camera module and the first shield via the wire, thereby allowing the grounding spring and the first and second shields to prevent external electromagnetic waves from affecting signals communicated between the camera module to a printed circuit board via the wire.

Abstract: An auxiliary illumination device includes a circuit board, a lamp cover including a high illumination light cover mounted on the circuit board and a low illumination light cover mounted on the circuit board, and at least two lamps electrically connected to the circuit board and disposed inside the high illumination light cover and the low illumination light cover respectively.

Abstract: An electrical socket for electrically connecting with a camera module includes a housing, a grounding spring embedded in the housing, a plurality of terminals received in the housing, and a pair of first shields in collaboration with a pair of second shields for substantially enclosing the housing, and a wire embedded in the housing for electrically connecting one of the first shields and the grounding spring. The grounding spring defines a second contacting portion for providing electrical connection between a corresponding ground pad of the camera module and the first shield via the wire, thereby allowing the grounding spring and the first and second shields to prevent external electromagnetic waves from affecting signals communicated between the camera module to a printed circuit board via the wire.

Abstract: An exemplary circuit board assembly includes a circuit board, at least one conductor, and a reinforcing board. The circuit board has at least one hole formed therein. Each conductor is received in one respective hole. The reinforcing board is attached to the circuit board and is electrically connected to the circuit board via the at least one conductor. The present invention also relates to a method of making the circuit board assembly.

Abstract: A testing system for testing performance of a number of image sensor modules includes a data transforms module, a number of selection switches and a testing processor. The data transform module has a pin assembly corresponding to the input/output pin assembly. The pin assembly includes a first pin and a second pin. The selection switches are configured for selecting the high level signal or the low level signal and providing the signal level to the control signal pins of the electronic assemblies. The testing processor is electronically connected to the data transform module and configured for processing data from the data transform module. In testing, the image sensor modules coupled together through a base do not need to be separated from each other, thus facilitating the next process. Therefore, the failure rate of the image sensor modules is decreased and cost is reduced.

Abstract: A camera module (200) includes a lens module and a base (210) with a sensor installed thereon. The base is provided with at least two supporting protrusions (222) extending therefrom. Each protrusion is oriented the lens module, and the lens module is fixedly to and contacts with the at least two supporting protrusions. A colloid layer surrounding the sensor is sandwiched between the second end of the holder and the base. Electronic components are disposed on the circuit board and covered by the colloid layer.

Abstract: A circuit board assembly (100) includes a circuit board (10) and at least one electrical element (20). The circuit board includes a dielectric substrate (12) including a supporting surface (13), and at least one connecting part (14) formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media (28). At least one air-exhaust hole (16) extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media.

Abstract: An electrical connector for electrical connecting a camera module with a circuit board includes an insulative casing and a number of signal terminals. The insulative casing includes a bottom wall and a number of side walls. A receiving space is defined between the bottom wall and side walls for receiving the camera module. The bottom wall defines a receiving opening thereon. The signal terminals are fixed on the side walls and extending beyond the bottom wall configured for electrically connecting with the camera module and the circuit board. The present invention also relates to a camera device having the same.

Abstract: A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module.

Abstract: An image sensor chip package includes a base, a sidewall adhered on peripheries of the base, an image sensor chip adhered on a top face of the base, and a cover adhered with the sidewall. The base includes a top face and a bottom face formed on an opposite side to the top face defining a number of outer pads thereon. The sidewall includes a number of inner pads is disposed on the inner side of the sidewall and corresponding to electrically connect with the corresponding outer pads. The inner pads are disposed on the sidewall to make the base become little. Thus, a volume of the image sensor chip package becomes thinner compare with the conventional image sensor chip package.

Abstract: A camera module (100) configured to connect to an outer circuit board includes a lens barrel (12), a holder (14) and a sensing chip (20). The holder has a first end (141), an opposite second end (142). The first end defines a cavity (143) therethrough, and the lens barrel is engaged in the cavity of the first end. The second end defines an opening (144) communicating with the cavity. The sensing chip is attached to the second end thereby sealing the opening defined by the second end. The sensing chip has a back surface (21) away from the first end of the holder, and the back surface is provided with a plurality of welding spots (201) configured for connecting the sensing chip to the outer circuit board electrically and structurally.

Abstract: A circuit board assembly includes a circuit board, at least a conductive contact and a metal shielding device. The conductive contact is extended from a lateral edge of the circuit board and is electrically connected to the circuit board. The circuit board and the conductive contact are received in the metal shielding device with the conductive contact electrically connected to the metal shielding device. The conductive contact tightly contacts with the metal shielding device by the elasticity of the conductive contact, and the circuit board assembly can remove a static using the metal shielding device and avoid the contact failure. In addition, the conductive contact can be manufactured in manufacturing of the circuit board, the man-hour and human for affixing the conduct foam is leave out and cost is decreased.

Abstract: An image sensor package is provided. The image sensor package includes a basic body, an image sensor chip, a carrier, and at least one passive component. The image sensor chip is electrically and structurally connected to the basic body, the image sensor package including a sensitive region. The carrier positioned on a supporting portion of the image sensor package spacially surrounding the sensitive region of the image sensor chip. The at least one passive component carried by the carrier and electrically connected to the basic body.

Abstract: A LED display having a light guide plate comprises a LED display, a light guide plate and at least a light source. The light guide plate is disposed in the front of the display screen of the display and the light is projected by the light source and enters to the light guide plate. The light can reflect in the light guide plate. When the light passes through the light guide plate, the light guide plate is colorful because of the color of the light from the light source or a mixture of the color of the light and the color of the display screen.