Abstract: A circuit of a resonant power converter comprising: a high-side switch and a low-side switch, coupled to form a half-bridge switching circuit which is configured to switch a transformer for generating an output voltage; a high-side drive circuit, generating a high-side drive signal coupled to drive the high-side switch in response to a high-side control signal; a bias voltage, coupled to a bootstrap diode and a bootstrap capacitor providing a power source from the bootstrap capacitor for the high-side drive circuit; wherein the high-side drive circuit generates the high-side drive signal with a fast slew rate to turn on the high-side switch when the high-side switch is to be turned on with soft-switching; the high-side drive circuit generates the high-side drive signal with a slow slew rate to turn on the high-side switch when the high-side switch is to be turned on without soft-switching.

Abstract: A power module structure is provided. The power module structure includes a substrate, a copper layer, a metal layer, and a chip. The copper layer is disposed on the substrate. The metal layer is disposed on the copper layer. The area of the metal layer is smaller than that of the copper layer. The chip is disposed on the metal layer. The area of the chip is smaller than that of the metal layer.

Abstract: In some examples, a device can include a locking mechanism to couple the device to a computing device enclosure, a first portion at a first level to interact with a processor back-plate, and a second portion at a second level to interact with an area proximate to the processor back-plate, wherein the second portion protrudes to the second level toward the processor back-plate when the device is coupled to the computing device enclosure.

Abstract: Examples of back covers for devices are described. In an example, the back cover includes an air-vent, and a region of a surface of the back cover directing air dispensed by a cooling unit of the device toward the air-vent.

Abstract: A device to thermoelectrically cool a cooling fluid is described. The device includes a cooling fluid circulation system to circulate a cooling fluid which cools a hardware component of a computer. The device further includes a thermoelectric cooling unit to cool the cooling fluid. The device further includes a controller to execute temperature control instructions to control the thermoelectric cooling unit to cool the cooling fluid to a cooling temperature not lower than ambient temperature to reduce the risk of water condensation.

Abstract: An example non-transitory machine-readable storage medium includes instructions to determine whether a cooling fan is controlled by pulse wave modulation (PWM) or is voltage-controlled. When executed, the instructions cause a processor of a computing device to transmit first and second PWM test signals at different PWM duties to a fan connector connected to the cooling fan, receive a first and second fan speed signals in response, and determine, when the first fan speed signal is not equal to the second fan speed signal, that the cooling fan is a PWM-controlled fan. The instructions further cause the processor to transmit first and second voltage test signals at different voltages to the fan connector, receive a third fan and fourth speed signal in response, and determine, when the third fan speed signal is not equal to the fourth fan speed signal, that the cooling fan is a voltage-controlled fan.

Abstract: In one example, an electronic device is described, which includes a cooling element and a controller coupled to the cooling element. The controller may detect environmental data and system operating data of the electronic device during a period of time, obtain a user input associated with an acceptable noise level for the cooling element, and control the cooling element based on the environmental data, the system operating data, and the acceptable noise level of the cooling element.

Abstract: A wearable computing device mount may include a harness wearable by a user; a plate attached to the harness, wherein a computing device is selectively mounted to the plate via mechanical fasteners, the plate including a plurality of stanchions to separate a back side of the plate from the harness; and a docking station, the docking station to communicatively couple to the computing device.

Abstract: A collapsible conveyor rack for supporting a conveyor is disclosed to include a bottom rack unit including a frame body and a pivot connector, a folding unit including a pivot connector pivotally connected to the pivot connector of the bottom rack unit for allowing biasing of the folding unit relative to the bottom rack unit and a retractable portion connected to the pivot connector of the folding unit, a retracting unit including a retractable portion coupled to and retractable relative to the retractable portion of the folding unit, and a driving mechanism for moving the retracting unit relative to the folding unit.

Abstract: A wearable computing device mount may include a harness wearable by a user; a plate attached to the harness, wherein a computing device is selectively mounted to the plate via mechanical fasteners, the plate including a plurality of stanchions to separate a back side of the plate from the harness; and a docking station, the docking station to communicatively couple to the computing device.

Abstract: In one example, an electronic device is described, which includes a cooling element and a controller coupled to the cooling element. The controller may detect environmental data and system operating data of the electronic device during a period of time, obtain a user input associated with an acceptable noise level for the cooling element, and control the cooling element based on the environmental data, the system operating data, and the acceptable noise level of the cooling element.

Abstract: Example implementations relate to a fan cover with a plurality of openings. For example, a device may include a fan cover to a fan device and a heat conduction device, a portion of the heat conduction device being coupled to an inside surface of the fan cover. The fan cover provides airflow for heat dissipation in a computing device and surrounds at least a portion of the fan device. The fan device has a first side associated with an axis about which an impeller of the fan device is capable of rotating and a second side associated with blade edges of the impeller of the fan device. The fan cover includes a flat portion to surround the first side and a curved portion to surround the second side, the curved portion having a plurality of openings such that airflow produced by the fan device is capable of passing through.

Abstract: A collapsible conveyor rack for supporting a conveyor is disclosed to include a bottom rack unit including a frame body and a pivot connector, a folding unit including a pivot connector pivotally connected to the pivot connector of the bottom rack unit for allowing biasing of the folding unit relative to the bottom rack unit and a retractable portion connected to the pivot connector of the folding unit, a retracting unit including a retractable portion coupled to and retractable relative to the retractable portion of the folding unit, and a driving mechanism for moving the retracting unit relative to the folding unit.

Abstract: Example implementations relate to a fan cover with a plurality of openings. For example, a device may include a fan cover to a fan device and a heat conduction device, a portion of the heat conduction device being coupled to an inside surface of the fan cover. The fan cover provides airflow for heat dissipation in a computing device and surrounds at least a portion of the fan device. The fan device has a first side associated with an axis about which an impeller of the fan device is capable of rotating and a second side associated with blade edges of the impeller of the fan device. The fan cover includes a flat portion to surround the first side and a curved portion to surround the second side, the curved portion having a plurality of openings such that airflow produced by the fan device is capable of passing through.

Abstract: An exemplary embodiment of the present invention includes an add-on module. The add-on module is in contact with a base cooling plate that is connected to a thermal energy transport element and at least one thermal energy generating device when the cooling capacity of the base cooling plate is exceeded by the rating of the thermal energy generating device.