Patents by Inventor Fu-Yi Han

Fu-Yi Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11721882
    Abstract: One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: August 8, 2023
    Assignee: MediaTek Inc.
    Inventors: Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin, Hsing-Chih Liu
  • Publication number: 20210036405
    Abstract: One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.
    Type: Application
    Filed: October 20, 2020
    Publication date: February 4, 2021
    Applicant: MediaTek Inc.
    Inventors: Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin, Hsing-Chih Liu
  • Patent number: 10847869
    Abstract: One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: November 24, 2020
    Assignee: MediaTek Inc.
    Inventors: Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin, Hsing-Chih Liu
  • Publication number: 20180358685
    Abstract: One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.
    Type: Application
    Filed: May 9, 2018
    Publication date: December 13, 2018
    Inventors: Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen
  • Patent number: 9991780
    Abstract: A power management device includes a first power unit, a second power unit, and a control unit. The first power unit receives a first control signal of a first phase to generate a first current of the first phase flowing to an output node. The second power unit receives a second control signal of a second phase to generate a second current of the second phase flowing to the output node. A phase delay is the difference between the first phase and the second phase. The control unit receives a clock signal in a clock frequency to generate the first control signal and the second control signal. The control unit controls the phase delay to cancel a corresponding harmonic of the clock frequency at the output node.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: June 5, 2018
    Assignee: MEDIATEK INC.
    Inventors: Jhe-Jia Kuo, Fu-Yi Han
  • Publication number: 20160149479
    Abstract: A power management device includes a first power unit, a second power unit, and a control unit. The first power unit receives a first control signal of a first phase to generate a first current of the first phase flowing to an output node. The second power unit receives a second control signal of a second phase to generate a second current of the second phase flowing to the output node. A phase delay is the difference between the first phase and the second phase. The control unit receives a clock signal in a clock frequency to generate the first control signal and the second control signal. The control unit controls the phase delay to cancel a corresponding harmonic of the clock frequency at the output node.
    Type: Application
    Filed: August 19, 2015
    Publication date: May 26, 2016
    Inventors: Jhe-Jia KUO, Fu-Yi HAN
  • Patent number: 7463108
    Abstract: An active 90-degree phase shifter with LC-type emitter (source) degeneration is provided, which is practiced in an integrated circuit. The phase shifter comprises a first differential amplifier, having one first signal output end and comprising an inductor, a first transistor and a second transistor, wherein the inductor is connected to the emitters (sources) of the first and the second transistors; and a second differential amplifier, having one second signal output end and comprising a capacitor, a third transistor and a fourth transistor, wherein the capacitor is connected to the emitters (sources) of the third and the fourth transistors. Wherein the bases (gates) of the first and the fourth transistors are signal input ends, and the bases (gates) of the second and the third transistors are coupled together.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: December 9, 2008
    Assignee: National Sun Yat-Sen University
    Inventors: Tzyy-Sheng Horng, Jian-Ming Wu, Fu-Yi Han, Jenshan Lin
  • Publication number: 20070241835
    Abstract: An active 90-degree phase shifter with LC-type emitter (source) degeneration is provided, which is practiced in an integrated circuit. The phase shifter comprises a first differential amplifier, having one first signal output end and comprising an inductor, a first transistor and a second transistor, wherein the inductor is connected to the emitters (sources) of the first and the second transistors; and a second differential amplifier, having one second signal output end and comprising a capacitor, a third transistor and a fourth transistor, wherein the capacitor is connected to the emitters (sources) of the third and the fourth transistors. Wherein the bases (gates) of the first and the fourth transistors are signal input ends, and the bases (gates) of the second and the third transistors are coupled together.
    Type: Application
    Filed: September 22, 2006
    Publication date: October 18, 2007
    Applicant: NATIONAL SUN YAT-SEN UNIVERSITY
    Inventors: Tzyy-Sheng Horng, Jian-Ming Wu, Fu-Yi Han, Jenshan Lin