Patents by Inventor Fu Yi Lin

Fu Yi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250072075
    Abstract: A compound semiconductor device includes a substrate, a channel layer on the substrate, a barrier layer on the channel layer, a passivation layer on the barrier layer, and a contact area recessed into the passivation layer and the barrier layer. The channel layer is partially exposed at a bottom of the contact area. Abi-layer silicide film is disposed on the contact area.
    Type: Application
    Filed: November 13, 2024
    Publication date: February 27, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Da-Jun Lin, Fu-Yu Tsai, Bin-Siang Tsai, Chung-Yi Chiu
  • Publication number: 20250054883
    Abstract: An interposer includes a substrate having an inductor forming region thereon, a plurality of trenches within the inductor forming region in the substrate, a buffer layer lining interior surfaces of the plurality of trenches and forming air gaps within the plurality of trenches, and an inductor coil pattern embedded in the buffer layer within the inductor forming region.
    Type: Application
    Filed: September 11, 2023
    Publication date: February 13, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Da-Jun Lin, Bin-Siang Tsai, Fu-Yu Tsai, Chung-Yi Chiu
  • Publication number: 20250038103
    Abstract: A structure of an MIM capacitor and a heat sink include a dielectric layer. The dielectric layer includes a capacitor region and a heat dispensing region. A bottom electrode is embedded in the dielectric layer. A first heat conductive layer covers the dielectric layer. A capacitor dielectric layer is disposed on the first heat conductive layer within the capacitor region. A second heat conductive layer covers and contacts the capacitor dielectric layer and the first heat conductive layer. A top electrode is disposed within the capacitor region and the heat dispensing region and covers the second heat conductive layer. A first heat sink is disposed within the heat dispensing region and contacts the top electrode. A second heat sink is disposed within the heat dispensing region and contacts the first heat conductive layer and the second heat conductive layer.
    Type: Application
    Filed: August 14, 2023
    Publication date: January 30, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Da-Jun Lin, Bin-Siang Tsai, Fu-Yu Tsai, Chung-Yi Chiu
  • Publication number: 20250040158
    Abstract: A metal-insulator-metal capacitor includes a bottom electrode, a dielectric layer, a superlattice layer, a silicon dioxide layer and a top electrode stacked from bottom to top. The superlattice layer contacts the dielectric layer. A silicon dioxide layer has a negative voltage coefficient of capacitance.
    Type: Application
    Filed: August 15, 2023
    Publication date: January 30, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Da-Jun Lin, Bin-Siang Tsai, Fu-Yu Tsai, Chung-Yi Chiu
  • Publication number: 20250030337
    Abstract: A circuit of a resonant power converter comprising: a high-side switch and a low-side switch, coupled to form a half-bridge switching circuit which is configured to switch a transformer for generating an output voltage; a high-side drive circuit, generating a high-side drive signal coupled to drive the high-side switch in response to a high-side control signal; a bias voltage, coupled to a bootstrap diode and a bootstrap capacitor providing a power source from the bootstrap capacitor for the high-side drive circuit; wherein the high-side drive circuit generates the high-side drive signal with a fast slew rate to turn on the high-side switch when the high-side switch is to be turned on with soft-switching; the high-side drive circuit generates the high-side drive signal with a slow slew rate to turn on the high-side switch when the high-side switch is to be turned on without soft-switching.
    Type: Application
    Filed: February 6, 2024
    Publication date: January 23, 2025
    Inventors: Kun-Yu Lin, Hsin-Yi Wu, Yu-Chang Chen, Fu-Ciao Syu, Chia-Hsien Yang, Chien-Fu Tang, Ta-Yung Yang
  • Publication number: 20090181347
    Abstract: A bone augmentation product for guiding bone tissue regeneration includes a soft tissue barrier membrane in the form of a soft sheet, and a tissue-regeneration guiding material being integrally molded to one side of the soft tissue barrier membrane. The tissue-regeneration guiding material may be collagen for directly filling in a defective area on a tooth bed or an area on a bone requiring osteogenesis to thereby simplify the procedures and reduce the difficulty in a surgery.
    Type: Application
    Filed: January 15, 2008
    Publication date: July 16, 2009
    Inventors: Fu-Yi Lin, Yen-Ching Huang
  • Publication number: 20070224568
    Abstract: A tooth orthopedic appliance has a bracket, a plurality of middle supporting portions and a plurality of side wing portions. The bracket is connected to a surface of the tooth, wherein a base is provided on a middle part of the bracket. A main wire trench is utilized to locate a correcting wire. The plurality of middle supporting portions are located respectively at a middle part of two protruding portions of the bracket, wherein the middle supporting portions are parallel to the bracket and perpendicular to the main wire trench. A wire holding slot is formed in between the bracket and every middle supporting portion for hooking a holding wire. A notch is defined by sidewalls of the middle supporting portions and the side wing portions in order to locate the holding wire for locking a top portion of the correcting wire such that an unfastened condition is formed.
    Type: Application
    Filed: March 27, 2006
    Publication date: September 27, 2007
    Inventor: Fu-Yi Lin
  • Patent number: 6863528
    Abstract: An orthodontic pin includes a pin body and a fastening member screwed into the pin body. An elastic element is connected at an end to the orthodontic pin by extending the fastening member through a ring provided at the end of the elastic element before screwing it into the pin body. When the elastic element becomes loose due to any change in the position of a tooth being corrected, it can be determined the elastic element needs replacement. Since the fastening member can be easily loosened from the pin body of the orthodontic pin, the elastic element can be conveniently removed from the pin body to facilitate quick replacement of the elastic element.
    Type: Grant
    Filed: October 3, 2002
    Date of Patent: March 8, 2005
    Inventor: Fu Yi Lin
  • Publication number: 20040067464
    Abstract: An orthodontic pin includes a pin body and a fastening member screwed into the pin body. An elastic element is connected at an end to the orthodontic pin by extending the fastening member through a ring provided at the end of the elastic element before screwing it into the pin body. When the elastic element becomes loose due to any change in the position of a tooth being corrected, it can be determined the elastic element needs replacement. Since the fastening member can be easily loosened from the pin body of the orthodontic pin, the elastic element can be conveniently removed from the pin body to facilitate quick replacement of the elastic element.
    Type: Application
    Filed: October 3, 2002
    Publication date: April 8, 2004
    Inventor: Fu Yi Lin
  • Patent number: 6644970
    Abstract: A gum adjusting and shaping device mainly includes an outer die, an abutments of implanted tooth detachably put in the outer die, and a cap screw received in the abutments of implanted tooth for fixing the latter and the outer die to an artificial implant previously implanted in the tooth socket bone. The outer die is a cylindrical member having a rear end in the form of a truncated cone and can therefore advantageously expand the gum surrounding an empty tooth socket to where an artificial tooth is to be mounted. The expanded gum allows subsequent formation of a tooth mold deeply reaching the root of the abutments of implanted tooth to produce a desired artificial tooth completely matching with neighboring teeth.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: November 11, 2003
    Inventor: Fu Yi Lin
  • Publication number: 20030198920
    Abstract: A gum adjusting and shaping device mainly includes an outer die, an abutments of implanted tooth detachably put in the outer die, and a cap screw received in the abutments of implanted tooth for fixing the latter and the outer die to an artificial implant previously implanted in the tooth socket bone. The outer die is a cylindrical member having a rear end in the form of a truncated cone and can therefore advantageously expand the gum surrounding an empty tooth socket to where an artificial tooth is to be mounted. The expanded gum allows subsequent formation of a tooth mold deeply reaching the root of the abutments of implanted tooth to produce a desired artificial tooth completely matching with neighboring teeth.
    Type: Application
    Filed: April 23, 2002
    Publication date: October 23, 2003
    Inventor: Fu Yi Lin