Patents by Inventor Fu-Yu CHUANG

Fu-Yu CHUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of redistribution layer routing for 2.5-dimensional integrated circuit packages
    Patent number: 10558779
    Abstract: A method of redistribution layer routing for 2.5D integrated circuit packages is proposed, which is executed by a computer, the method comprising using the computer to perform the following: performing a MMSIM (modulus-based matrix splitting iteration method) based routing to assign pre-assignment nets to tracks such that total vertical distance from each bump pair to the assigned track is minimized; and performing a MWMCBM (minimum weighted maximum cardinality bipartite matching) based routing for bumps connected to the assigned tracks according to matching result to complete redistribution layer routing for integrated circuit packages.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: February 11, 2020
    Assignee: AnaGlobe Technology, Inc.
    Inventors: Chun-Han Chiang, Fu-Yu Chuang, Yao-Wen Chang, Chih-Che Lin, Chun-Yi Yang
  • Method of Redistribution Layer Routing for 2.5-Dimensional Integrated Circuit Packages
    Publication number: 20190370433
    Abstract: A method of redistribution layer routing for 2.5D integrated circuit packages is proposed, which is executed by a computer, the method comprising using the computer to perform the following: performing a MMSIM (modulus-based matrix splitting iteration method) based routing to assign pre-assignment nets to tracks such that total vertical distance from each bump pair to the assigned track is minimized; and performing a MWMCBM (minimum weighted maximum cardinality bipartite matching) based routing for bumps connected to the assigned tracks according to matching result to complete redistribution layer routing for integrated circuit packages.
    Type: Application
    Filed: May 31, 2018
    Publication date: December 5, 2019
    Inventors: Chun-Han CHIANG, Fu-Yu CHUANG, Yao-Wen CHANG, Chih-Che LIN, Chun-Yi YANG