Abstract: The present disclosure provides a base assembly of voice coil motor and a voice coil motor. The base assembly includes a base body having a first elastic piece connecting area, a lower elastic piece disposed on the first elastic piece connecting area, and a first terminal disposed in the base body. The first terminal has: a first conductive part disposed in the base body; a first terminal connecting part disposed on one side of the first conductive part and extending toward a direction away from the first conductive part, wherein a part of the first terminal connecting part protrudes from the first elastic piece connecting area and is contacted and connected with the lower elastic piece; and an engaging part disposed on one side of the first terminal connecting part and extending toward a direction away from the first terminal connecting part.

Abstract: An anti-twist structure of voice coil motor includes a base, a lens housing, an elastic sheet, a magnet, and a yoke member. The lens housing has a margin wall, and the margin wall has a first protrusion and a contact portion. The elastic sheet has a hollowed slot, and the first protrusion pass through the hollowed slot, so that the elastic sheet is disposed on a portion of the margin wall and on the contact portion. The yoke member has an upper wall and a side wall. The side wall is disposed at one side of the upper wall and the side wall extends outward in a direction not parallel to the upper wall. The yoke member surrounds the lens housing, the elastic sheet, and the magnet. The lens housing has a deflectable angle relative to a horizontal reference line.

Abstract: An anti-twist structure of voice coil motor includes a base, a lens housing, an elastic sheet, a magnet, and a yoke member. The lens housing has a margin wall, and the margin wall has a first protrusion and a contact portion. The elastic sheet has a hollowed slot, and the first protrusion pass through the hollowed slot, so that the elastic sheet is disposed on a portion of the margin wall and on the contact portion. The yoke member has an upper wall and a side wall. The side wall is disposed at one side of the upper wall and the side wall extends outward in a direction not parallel to the upper wall. The yoke member surrounds the lens housing, the elastic sheet, and the magnet. The lens housing has a deflectable angle relative to a horizontal reference line.

Abstract: Epitaxial source/drain structures for enhancing performance of multigate devices, such as fin-like field-effect transistors (FETs) or gate-all-around (GAA) FETs, and methods of fabricating the epitaxial source/drain structures, are disclosed herein. An exemplary device includes a dielectric substrate. The device further includes a channel layer, a gate disposed over the channel layer, and an epitaxial source/drain structure disposed adjacent to the channel layer. The channel layer, the gate, and the epitaxial source/drain structure are disposed over the dielectric substrate. The epitaxial source/drain structure includes an inner portion having a first dopant concentration and an outer portion having a second dopant concentration that is less than the first dopant concentration. The inner portion physically contacts the dielectric substrate, and the outer portion is disposed between the inner portion and the channel layer. In some embodiments, the outer portion physically contacts the dielectric substrate.

Abstract: A semiconductor device and method for forming the semiconductor device are provided. In some embodiments, a semiconductor substrate comprises a device region. An isolation structure extends laterally in a closed path to demarcate the device region. A first source/drain region and a second source/drain region are in the device region and laterally spaced. A sidewall of the first source/drain region directly contacts the isolation structure at a first isolation structure sidewall, and remaining sidewalls of the first source/drain region are spaced from the isolation structure. A selectively-conductive channel is in the device region, and extends laterally from the first source/drain region to the second source/drain region. A plate comprises a central portion and a first peripheral portion. The central portion overlies the selectively-conductive channel, and the first peripheral portion protrudes from the central portion towards the first isolation structure sidewall.

Abstract: A method of utilizing an audio signal to transmit data for conducting electronic transactions includes in a user device, converting user identification data into a first audio signal and transmitting the first audio signal to a base device; in the base device, converting the first audio signal into the user identification data; in the base device, transmitting the user identification data and transaction content to a server device; and in the server device, obtaining authorization of a validation entity by utilizing the user identification data and the transaction content, for obtaining a transaction number and transmitting the transaction number to the base device.

Abstract: The invention discloses a method for transmitting digital contents between devices. First digital contents are modulated into an audio signal in a first device, wherein the first digital contents include contact information and at least one index of at least one second digital content. The audio signal is outputted by at least one audio generator of the first device and then received by at least one audio receiver of a second device. The audio signal is demodulated in the second device to make the second device obtain the first digital contents. The second device obtains the at least one second digital content according to the at least one index of the at least one second digital contents through a wired or wireless communication.

Abstract: A control system for detecting air wave is provided and applied to an electronic device. The control system for detecting air wave includes a detecting module, at least one first application and a service module. The detecting module is configured to detect an air wave and transform the air wave into an electronic signal. The service module includes a service scheduling module and a decoding module. The service scheduling module controls the detecting module to obtain the electronic signal. The decoding module decodes the electronic signal to a digital content. The digital content is transmitted to the corresponding first application.

Abstract: The invention discloses a method for transmitting digital contents between devices. First digital contents are modulated into an audio signal in a first device, wherein the first digital contents include contact information and at least one index of at least one second digital content. The audio signal is outputted by at least one audio generator of the first device and then received by at least one audio receiver of a second device. The audio signal is demodulated in the second device to make the second device obtain the first digital contents. The second device obtains the at least one second digital content according to the at least one index of the at least one second digital contents through a wired or wireless communication.

Abstract: A package structure for a multi-chip integrated circuit (IC) is disclosed and the structure includes substrate having a position for bonding with chips for chip-bonding and having at least a hole for the passage of a gold wire in the course of wire-bonding, a first chip attached to the substrate with a chip bonding agent and being wire-bonded on the substrate and the chip bonding position being opposite to the 2nd chip with the substrate in-between, and the gold wire of the wire-bonding passed through the hole of the substrate from the substrate bonding pad at the substrate and on the same lateral side of the second chip and being connected to the pin pad of the first chip, at least a second chip being flip-chip bonded onto the substrate and the bonding position being at different sides of the bonding between the substrate and the first chip, and a package body including filler of the second chip extended to cover the hole of the substrate and the first chip and the gold wire connected to the substrate and th

Abstract: A fabrication method for solder bump pattern of rear section wafer package is disclosed and the method includes the steps of: (a) pattern-etching the wafer at a passivation layer for the positioning of the solder bump; (b) depositing the entire under bump metal layer,

Abstract: A method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad is disclosed. The method comprises the steps of exposing the copper bonding pad of a wafer which has been completed with semiconductor circuit fabrication; covering the copper bonding pad of the wafer with a protective anti-oxidization film which will be vaporized when heated; performing wire bonding directly without requiring the removal of the protective film, employing ultrasonic vibration energy, pressurizing deformation energy and heat energy in the course of bonding to vaporize the protective film so that the metal wire and the copper pad form a large area intermetallic compound layer for bonding.

Abstract: A method of metal-electro-plating for IC package substrate comprising the steps of: forming vias on the package substrate coated with copper film on both sides thereof; electro-plating the vias to form electrical conductive holes between the top layer and the bottom layer of the package substrate; coating a resisting agent where the patterns should be formed on the top layer and on the entire bottom layer of the package substrate; etching the pattern to form circuit without plating lines on the top layer of the substrate, and removing the resisting agent; coating with a resisting agent on the top side and the bottom side of the package substrate but the wiring position to be electro-plated as surface finish for wire-bonding electro-plating on the top side of the package substrate not being applied with the resisting agent; electro-plating the substrate with nickel and gold, and removing the resisting agent; fabricating the circuit on the bottom side of the package substrate and coating with a resisting agent

Abstract: An open-typed multi-chip stack-packaging is disclosed and the packaging comprises a substrate having a first surface and a second surface, at least a through opening formed on the substrate, and including at least two layers of circuitry to electrically transmit signals; at least a first chip positioned on the upper section of the opening of the first surface and a plurality of protruded blocks being soldered onto the circuitry on the first surface of the substrate at the external region of the substrate for electrically connection; at least a second chip stacked onto the first chip and the second chip being connected electrically to the circuitry of the first surface with gold lines; at least a third chip positioned at the lower section of the opening of the second surface and having a size smaller than the first chip, and a plurality of protruded blocks being used to electrically bond with the center position of the first chip, and adhesive being used to fill the first chip and the third chip, and the regio

Abstract: A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

Abstract: A fabrication method of semiconductor packaging and the packaging element is disclosed. A layer of copper is formed on a thick heat-resistant tape and the surface of the copper layer is coated with a light sensitive photoresist. A light source passes through a pre-fabricated circuit negative being performed on the copper layer such that the photoresist is retained on the surface of the copper layer. An etching step is performed so as to obtain a copper wire with circuit diagram. After that, a wire bonding or a flip chip method is used to bind copper wire circuit with the chip. An appropriate packaging method is performed, a packaging element is obtained after the heat-resistant tape is removed.

Abstract: A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

Abstract: A device for making metal bumps includes a hard conical tubular member having a vertical passage which is conical in shape and has a larger diameter at a bottom such that a lower portion of the vertical passage is larger than an upper portion of the vertical passage, whereby a metal wire is inserted into the vertical passage of the hard conical tubular member, with a lower end of the metal wire protruded downwardly out of the vertical passage, the lower end of the metal wire is melted to form a ball, the hard conical tubular member is approached to a raised platform formed on a top of a chip, and a load is applied to the metal wire and the metal wire is heated and bonded on the pad of die and ultrasonic energy is applied to deform the melted metal so as to fill up the lower portion of the vertical passage thereby forming a metal bump on the raised platform of the chip, and finally the hard conical tubular member is removed to pull off the necking position between the metal wire and a top of the metal bump the

Abstract: A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.

Abstract: A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.