Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.

Abstract: A ratchet wrench and an external ratchet bushing anti-detachment and quick-release structure have an anti-detachment and quick-release assembly, a ratchet wrench and an external component. The anti-detachment and quick-release assembly can be pushed up and down by displacement and is magnetic, a ratchet wheel is arranged in the actuating end of the ratchet wrench, and the anti-detachment and quick-release assembly is fixed on one side of the ratchet wheel. When the external component is placed in the ratchet, it can be fixed by the magnetic adsorption of the anti-detachment and quick-release assembly. When disassembling, the external component is pushed against the external component to disengage from the ratchet. When the ratchet wrench is subjected to external force, the components will not be disengaged and damaged, and the overall structural assembly stability is good, so as to gain structural stability and allow safety use.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: An electronic structure includes a packaging structure, a circuit pattern structure, an underfill and a protrusion structure. The circuit pattern structure is disposed over the packaging structure. A gap is between the circuit pattern structure and the packaging structure. The underfill is disposed in the gap. The protrusion structure is disposed in the gap, and is configured to facilitate the distributing of the underfill in the gap.

Abstract: An electronic package structure includes a lower circuit pattern structure, an upper circuit pattern structure, a reflowable material and at least one core element. The upper circuit pattern structure is disposed above the lower circuit pattern structure. The reflowable material is disposed between the upper circuit pattern structure and the lower circuit pattern structure. The core element attaches to the reflowable material and is configured to inhibit displacement of the at least one core element during a reflow process.

Abstract: An electronic package structure includes an electronic structure, a wiring structure, an electrical contact and a support layer. The wiring structure is located over the electronic structure. The electrical contact connects the wiring structure and the electronic structure. The support layer is disposed around the electrical contact and has a surface facing the electrical contact. The surface includes at least one inflection point in a cross-sectional view.

Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.

Abstract: A semiconductor device package and manufacturing method thereof are provided. The semiconductor device package includes a first conductive structure, a second conductive structure, a connection element, a conductive member, an encapsulant and a binding layer. The first conductive structure includes a first circuit layer. The second conductive structure is disposed over the first conductive structure. The connection element is disposed on and electrically connected to the first circuit layer. The conductive member protrudes from the second conductive structure. The encapsulant is disposed between the first conductive structure and the second conductive structure. The binding layer is disposed between the second conductive structure and the encapsulant.

Abstract: A semiconductor device package and manufacturing method thereof are provided. The semiconductor device package includes a first conductive structure, a second conductive structure, a connection element, a conductive member, an encapsulant and a binding layer. The first conductive structure includes a first circuit layer. The second conductive structure is disposed over the first conductive structure. The connection element is disposed on and electrically connected to the first circuit layer. The conductive member protrudes from the second conductive structure. The encapsulant is disposed between the first conductive structure and the second conductive structure. The binding layer is disposed between the second conductive structure and the encapsulant.

Abstract: An output driving circuit capable of reducing EMI effect includes a non-overlapping signal generation unit for generating a first non-overlapping signal and a second non-overlapping signal according to an input signal, a pre-driver for generating a first pre-driving signal and a second pre-driving signal according to the first non-overlapping signal and the second non-overlapping signal, a high-side switch, a low-side switch, and a control unit for controlling the high-side switch or the low-side switch to be switched into a weak on state to reduce load inductive current effect for a load.

Abstract: An adjustable frequency generator for a power supply is disclosed. The adjustable frequency generator comprises a waveform generator, a voltage generator and a comparator. The waveform generator is used for generating a saw wave. The voltage generator is used for generating a variable upper reference voltage and a variable lower reference voltage according to variation of a load. The comparator is coupled to the waveform generator and the voltage generator and used for comparing the saw wave with the variable upper reference voltage and the variable lower reference voltage and generating an output signal. A frequency of the output signal decreases when the load becomes lighter.

Abstract: An offset voltage calibration method is disclosed, which is utilized for calibrating an offset voltage of an electronic device during a calibration period. The offset voltage calibration method includes generating a control signal according to an output signal of the electronic device, counting a count value and generating an offset indication signal according to the control signal, stopping counting and generating a final count value according to a compensation value after the output signal changes state, generating a calibration signal according to the count value or the final count value, and calibrating the offset voltage according to the offset indication signal and the calibration signal.

Abstract: An output driving circuit capable of reducing EMI effect includes a non-overlapping signal generation unit for generating a first non-overlapping signal and a second non-overlapping signal according to an input signal, a pre-driver for generating a first pre-driving signal and a second pre-driving signal according to the first non-overlapping signal and the second non-overlapping signal, a high-side switch, a low-side switch, and a control unit for controlling the high-side switch or the low-side switch to be switched into a weak on state to reduce load inductive current effect for a load.

Abstract: An offset voltage calibration method is disclosed, which is utilized for calibrating an offset voltage of an electronic device during a calibration period. The offset voltage calibration method includes generating a control signal according to an output signal of the electronic device, counting a count value and generating an offset indication signal according to the control signal, stopping counting and generating a final count value according to a compensation value after the output signal changes state, generating a calibration signal according to the count value or the final count value, and calibrating the offset voltage according to the offset indication signal and the calibration signal.

Abstract: A power supply device for driving an amplifier includes a power generator for providing a first voltage for a first power reception end of the amplifier, a power conversion unit coupled to the power generator, for converting the first voltage into a second voltage, a charge pump coupled between the power conversion unit and a second power reception end of the amplifier, for generating a third voltage for the amplifier according to the second voltage, and a control unit coupled to the power conversion unit, for controlling the power conversion unit, so as to adjust the second voltage to make the third voltage equal to a specific multiple of the first voltage.

Abstract: A switching amplifier includes an input end for receiving an input signal, a reference signal reception end for receiving a reference signal, a feedback end for receiving a feedback signal, an output end for outputting an output signal, an integration circuit for performing integration operation on the input signal according to the output signal and the feedback signal, so as to generate an integration result, a comparison circuit coupled to the integration circuit, the reference signal end, and the output end, for comparing the integration result and the reference signal, so as to generate the output signal for the output end, and a feedback circuit coupled between an output end of the integration circuit and the feedback end, for generating the feedback signal for the feedback end to clamp the integration result to a predetermined value when the integration result reaches the predetermined value.

Abstract: A power supply device for driving first and second amplifiers includes a first power generator, a second power generator, a charge pump and a control unit. The first power generator provides a first voltage for first power reception ends of the first and second amplifiers. The second power generator provides a second voltage. The charge pump is coupled between the second power generator and a second power reception end of the first amplifier and between the second power generator and a second power reception end of the second amplifier, and is used for generating a third voltage for the first and second amplifiers according to the second voltage. The control unit is coupled to the second power generator and is used for controlling the second power generator, so as to adjust the second voltage to make the third voltage equal to a multiple of the first voltage.

Abstract: A power supply device for driving first and second amplifiers includes a first power generator, a second power generator, a charge pump and a control unit. The first power generator provides a first voltage for first power reception ends of the first and second amplifiers. The second power generator provides a second voltage. The charge pump is coupled between the second power generator and a second power reception end of the first amplifier and between the second power generator and a second power reception end of the second amplifier, and is used for generating a third voltage for the first and second amplifiers according to the second voltage. The control unit is coupled to the second power generator and is used for controlling the second power generator, so as to adjust the second voltage to make the third voltage equal to a multiple of the first voltage.

Abstract: A power supply device for driving an amplifier includes a power generator for providing a first voltage for a first power reception end of the amplifier, a power conversion unit coupled to the power generator, for converting the first voltage into a second voltage, a charge pump coupled between the power conversion unit and a second power reception end of the amplifier, for generating a third voltage for the amplifier according to the second voltage, and a control unit coupled to the power conversion unit, for controlling the power conversion unit, so as to adjust the second voltage to make the third voltage equal to a specific multiple of the first voltage.

Abstract: A switching amplifier includes an input end for receiving an input signal, a reference signal reception end for receiving a reference signal, a feedback end for receiving a feedback signal, an output end for outputting an output signal, an integration circuit for performing integration operation on the input signal according to the output signal and the feedback signal, so as to generate an integration result, a comparison circuit coupled to the integration circuit, the reference signal end, and the output end, for comparing the integration result and the reference signal, so as to generate the output signal for the output end, and a feedback circuit coupled between an output end of the integration circuit and the feedback end, for generating the feedback signal for the feedback end to clamp the integration result to a predetermined value when the integration result reaches the predetermined value.