Patents by Inventor FU-YUAN TSAI

FU-YUAN TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170299
    Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Inventors: KUN-JU LI, ANG CHAN, HSIN-JUNG LIU, WEI-XIN GAO, JHIH-YUAN CHEN, CHUN-HAN CHEN, ZONG-SIAN WU, CHAU-CHUNG HOU, I-MING LAI, FU-SHOU TSAI
  • Patent number: 11984261
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng, Yi Heng Tsai, You-Ru Lin, Yen-Wen Chen, Fu-Chun Huang, Fan Hu, Ching-Hui Lin, Yan-Jie Liao
  • Patent number: 11923205
    Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: March 5, 2024
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Kun-Ju Li, Ang Chan, Hsin-Jung Liu, Wei-Xin Gao, Jhih-Yuan Chen, Chun-Han Chen, Zong-Sian Wu, Chau-Chung Hou, I-Ming Lai, Fu-Shou Tsai
  • Patent number: 10805771
    Abstract: A method for sending location information continuously of a user in need of rescue and carrying a location tracking device of the disclosure includes determining whether a rescue-needed signal is received, and if so controlling a first positioning module of the location tracking device to send a first positioning signal. Determining whether a power level of the location tracking device is more or less than a predetermined power level and turning off the first positioning module if less. If so, the location tracking device sends a second positioning signal when the power level is less than the predetermined power level, the power consumption of the second positioning module being less than that of the first positioning module. Thereby, transmission of a rescue signal is enabled for an extended period and over a longer distance.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: October 13, 2020
    Assignee: Goldtek Technology Co., Ltd.
    Inventors: Tung-Sheng Tu, Fu-Yuan Tsai
  • Publication number: 20200103542
    Abstract: A structure safety detection system includes a first sensor, a second sensor, and a server. The first sensor detects a wobble and slant state of a structure and generates a corresponding first detection result. The second sensor detects a characteristic width of the structure and generates a corresponding second detection result. The server analyzes the first detection result and the second detection result and generates a corresponding first analysis result.
    Type: Application
    Filed: December 14, 2018
    Publication date: April 2, 2020
    Inventors: YEN-CHING LEE, YU-CHANG SONG, FU-YUAN TSAI
  • Publication number: 20190386754
    Abstract: A method for testing a wireless transceiver includes the following steps: electrically connecting a golden sample of the wireless transceiver to a first automatic test equipment (ATE); electrically connecting at least one device under test (DUT) of the wireless transceiver to a second ATE; transmitting a first packet to the golden sample; switching the at least one DUT to a receiving mode; determining whether a second packet from the golden sample is received; and determining whether the at least one DUT is normal based on a receiving result of the at least one DUT when the second packet is received.
    Type: Application
    Filed: June 14, 2019
    Publication date: December 19, 2019
    Inventors: YEN-CHING LEE, FU-YUAN TSAI
  • Publication number: 20190228102
    Abstract: The present disclosure provides a data crawling and processing method for a data crawling and processing device. The data crawling and processing device comprise a crawling interface, a processing module, an identification module and a grouped data section. The data crawling and processing method comprises below steps. The data crawling and processing device connects to a data source through the crawling interface. The data source comprises an original data and a featured content. The crawling interface receives the featured content. The crawling interface produces a tag corresponding to the featured content. The crawling interface crawls the original data from the data source, and adds the tag to the original data to produces a tagged data. The identification module determines whether the tagged data is acceptable. If the tagged data is acceptable, the processing module groups the tagged data to form a grouped data.
    Type: Application
    Filed: May 28, 2018
    Publication date: July 25, 2019
    Inventors: JUI-CHI LEE, DARWIN KURNIAWAN OH, FU-YUAN TSAI, CHIH-HAO HUANG