Patents by Inventor Fu-Yuan Yao

Fu-Yuan Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11670622
    Abstract: A stacked semiconductor package has a substrate, a first chip, at least one spacer, a second chip and an encapsulation. The first chip and the second chip are intersecting stacked on the substrate. The at least one spacer is stacked on the substrate to support the second chip. The encapsulation is formed to encapsulate the substrate, the first chip, the at least one spacer and the second chip. The at least one spacer is made of the material of the encapsulation. Therefore, the adhesion between the at least one spacer and the encapsulation is enhanced to avoid the delamination during the reliability test and enhances the reliability of the stacked semiconductor package.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: June 6, 2023
    Assignee: Powertech Technology Inc.
    Inventors: Yin-Huang Kung, Chia-Hung Lin, Fu-Yuan Yao, Chun-Wu Liu
  • Publication number: 20220165709
    Abstract: A stacked semiconductor package has a substrate, a first chip, at least one spacer, a second chip and an encapsulation. The first chip and the second chip are intersecting stacked on the substrate. The at least one spacer is stacked on the substrate to support the second chip. The encapsulation is formed to encapsulate the substrate, the first chip, the at least one spacer and the second chip. The at least one spacer is made of the material of the encapsulation. Therefore, the adhesion between the at least one spacer and the encapsulation is enhanced to avoid the delamination during the reliability test and enhances the reliability of the stacked semiconductor package.
    Type: Application
    Filed: March 23, 2021
    Publication date: May 26, 2022
    Applicant: Powertech Technology Inc.
    Inventors: Yin-Huang KUNG, Chia-Hung LIN, Fu-Yuan YAO, Chun-Wu LIU
  • Publication number: 20090139571
    Abstract: A solar cell and a manufacturing method thereof are provided herein. The solar cell includes a substrate with a first transparent conductive layer, a micro- or nano-roughing structure formed on the first transparent conductive layer, and a semiconductor active layer formed on the micro- or nano-roughing structure and covering the micro- or nano-roughing structure.
    Type: Application
    Filed: July 7, 2008
    Publication date: June 4, 2009
    Inventors: Chii-Chang CHEN, Chia-Hua Chan, Huang-Nan Wu, Fu-Yuan Yao, Sheng-Hui Chen, Hung-Chien Shieh, Cheng-Chung Lee, Tai-Kang Shing
  • Publication number: 20090071532
    Abstract: A method for fabricating a solar cell device is provided. A container containing a solution with a plurality of nano or micro particles is provided. A solar chip is provided, and the plurality of nano or micro particles in the solution are uniformly coated on a surface of the solar chip by soaking the solar chip in the solution, wherein the plurality of nano or micro particles uniformly coated on the surface of the solar chip are used as an anti-reflective layer. The solar chip is taken out from the solution after being uniformly coated with the plurality of nano or micro particles on a surface thereof.
    Type: Application
    Filed: February 4, 2008
    Publication date: March 19, 2009
    Inventors: Chia-Hua Chan, Chii-Chang Chen, Fu-Yuan Yao, Hung-Nan Wu, Tai-Kang Shing
  • Publication number: 20080236661
    Abstract: A solar cell is provided. The solar cell includes a substrate, at least one first photo-electric conversion unit, at least one second photo-electric conversion unit and a reflective layer. The first photo-electric conversion unit and the second-electric conversion unit are disposed on the substrate. The reflective layer is disposed between the first photo-electric conversion unit and the second photo-electric conversion unit. The reflective layer comprises a plurality of thin films having at least two kinds of refractive indices and alternately stacked.
    Type: Application
    Filed: August 7, 2007
    Publication date: October 2, 2008
    Inventors: Fu-Yuan Yao, Shih-Peng Chen, Tai-Kang Shing