Patents by Inventor Fu-Yun CHENG

Fu-Yun CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10153041
    Abstract: Disclosed is a dual inline memory module with temperature-sensing scenario modes. A plurality of volatile memory components and an EEPROM component are disposed on a module board. A plurality of LED components and a scenario-lighting controller are disposed at a radiant side of the module board. A light bar is located at the radiant side of the module board without direct installing relationship. A plurality of clamping-type heat spreaders are fastened to one another in a manner that the light bar is tightly clamped. Therein, the power of the scenario-lighting controller component is shared and linked with the power supply system of the LED components and the signals of the scenario-lighting controller component are shared and linked with the signal connection system of the EEPROM component.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: December 11, 2018
    Assignee: Corsair Memory Inc.
    Inventors: Shu-Liang Ning, Fu-Yun Cheng, Ting-Yi Chang
  • Publication number: 20170343198
    Abstract: Disclosed is a dual inline memory module with temperature-sensing scenario modes. A plurality of volatile memory components and an EEPROM component are disposed on a module board. A plurality of LED components and a scenario-lighting controller are disposed at a radiant side of the module board. A light bar is located at the radiant side of the module board without direct installing relationship. A plurality of clamping-type heat spreaders are fastened to one another in a manner that the light bar is tightly clamped. Therein, the power of the scenario-lighting controller component is shared and linked with the power supply system of the LED components and the signals of the scenario-lighting controller component are shared and linked with the signal connection system of the EEPROM component.
    Type: Application
    Filed: May 31, 2016
    Publication date: November 30, 2017
    Inventors: Shu-Liang NING, Fu-Yun CHENG, Ting-Yi CHANG