Abstract: A transparent PCB includes a transparent base film, a hardened layer, an electrode film, a first conductive paste, a second conductive paste, and an electronic component. The hardened layer is formed on a side of the transparent base film. The electrode film is formed on a side of the hardened layer. The electrode film includes a first transparent conductive oxide layer, a metal layer, and a second transparent conductive oxide layer. The first conductive paste is formed on the electrode film. The second conductive paste is formed on the electrode film and spaced from the first conductive paste. The electronic component is electrically connected to the electrode film through the first conductive paste and the second conductive paste. The present invention also needs to provide a method for manufacturing the transparent PCB.

Abstract: The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.

Abstract: A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber. The present invention also needs to provide a method for manufacturing the heat equalization plate.

Abstract: A multilayer circuit board includes a first connecting wiring board comprising a first bonding layer and a liquid crystal polymer formed on the first bonding layer. The first bonding layer comprises a first insulating filler. A fusion temperature of the first bonding layer is less than a fusion temperature of the liquid crystal polymer. The multilayer circuit board further includes a first wiring board and a second wiring board disposed on opposite sides of the first connecting wiring board. The first wiring board is combined with the first bonding layer. A method for manufacturing such multilayer circuit board is also provided.

Abstract: A resin having thermal conductivity comprises a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight, a polyphenylene ether in 3 to 35 parts by weight; and a dendritic acrylate oligomer in 3 to 45 parts by weight. An adhesive layer and a circuit board using the resin composition are also described.

Abstract: A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

Abstract: A heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The graphite sheet is connected to the second surface. At least one containing cavity is defined on an interface between the second surface and the graphite sheet. The heat insulating material is filled in the at least one containing cavity to form a heat insulating structure.

Abstract: A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Abstract: A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

Abstract: A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

Abstract: A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

Abstract: An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

Abstract: A heat dissipation device includes etched or other grooves for adhesive surrounding etched or other recesses for heat-dissipating fluid, these being created in a first copper sheet and a second copper sheet brought together. The first copper sheet includes first recesses and the second copper sheet includes corresponding second recesses. The second copper sheet is adhesively fixed on the first copper sheet and an airtight receiving cavity is formed by the first and second recesses being brought together. The heat-dissipating fluid in the airtight receiving cavity carries away heat generated by a heat-producing device to which the heat-dissipating device is fixed.

Abstract: A resin having thermal conductivity comprises a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight, a polyphenylene ether in 3 to 35 parts by weight; and a dendritic acrylate oligomer in 3 to 45 parts by weight. An adhesive layer and a circuit board using the resin composition are also described.

Abstract: A film shielding against electromagnetic interference comprises an insulating layer, a silver layer, and a conductive adhesive layer. The insulating layer is made of polyimide. The metal layer is formed on the insulating layer. The conductive adhesive layer is coated on the metal layer and is very thin but renders the film less prone to bubbling and rupturing when in place.

Abstract: A method for manufacturing high frequency signal transmission structure comprises: providing two dielectric layers, each of the two dielectric layers defining a top surface and a bottom surface and comprising a channel with a bottom open end opened at the top surface and a top open end opened at the bottom surface, an inner diameter of the each of the two channels gradually reducing further from the top open end to the bottom open end; providing a circuit layer with a transmission portion; providing two copper plates; combining the circuit layer, the two dielectric layers and the two copper plates to form a combination; providing a shielding layer around the two air chambers; and providing at least one solder mask covering the shielding layer. The present disclosure also provides a high frequency signal transmission structure obtained by the method.

Abstract: A cooling plate of a first embodiment of the present disclosure is configured with a electronic device for heat dissipation. The cooling plate of the first embodiment disclosure includes a first plate, a second plate opposite to the first plate, a bonding line connected with the first plate and the second plate, a plurality of supporting columns, and a cooling liquid received between the first plate and the second plate. The first plate, the second plate, and the bonding line together define a cavity, the plurality of supporting columns and the cooling liquid are received in the cavity. The plurality of supporting columns connects perpendicularly with the first plate and the second plate. The cooling liquid communicates between the plurality of the supporting columns.

Abstract: A cooling plate of a first embodiment of the present disclosure is configured with a electronic device for heat dissipation. The cooling plate of the first embodiment disclosure includes a first plate, a second plate opposite to the first plate, a bonding line connected with the first plate and the second plate, a plurality of supporting columns, and a cooling liquid received between the first plate and the second plate. The first plate, the second plate, and the bonding line together define a cavity, the plurality of supporting columns and the cooling liquid are received in the cavity. The plurality of supporting columns connects perpendicularly with the first plate and the second plate. The cooling liquid communicates between the plurality of the supporting columns.

Abstract: A wireless power consortium device includes a flexible substrate layer, at least one first WPC coil on the flexible substrate layer, at least one first NFC coil on the flexible substrate layer, at least one WPC module, and at least one NFC module. Each WPC module comprises a first matching circuit and a WPC power supply chip electrically connected to the first matching circuit. Each NFC module comprises a second matching circuit and an NFC controlling chip electrically connected to the second matching circuit. The first matching circuit and the second matching circuit are different parts of one circuit and are formed on the flexible substrate layer.

Abstract: A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.