Abstract: The invention provides a manufacturing method for a non-invasive blood glucose monitoring device, which comprises the following steps: providing a substrate; performing an injection molding process or an electroplating process, to form at least one light-blocking wall on the substrate, wherein each light-blocking wall includes a lower wall-structure and an upper wall-structure, and the lower wall-structure connects the substrate and the upper wall-structure connects the lower wall-structure; arranging a light-emitting element and a light-receiving element on the substrate and separating the light-emitting element and the light-receiving element by the at least one light-blocking wall; forming a packaging structure on the substrate in which the light-emitting element and the light-receiving element are packaged; and disposing a transparent cover on the packaging structure and the at least one light-blocking wall and limiting the transparent cover to a configuration height by the at least one light-blocking wal

Abstract: Semiconductor packages including a die pad, at least one connecting bar, at least one supporting portion, a plurality of leads, a semiconductor chip, a heat sink and a molding compound. The connecting bar connects the die pad and the supporting portion. The leads are electrically isolated from each other and the die pad. The semiconductor chip is disposed on the die pad and electrically connected to the leads. The heat sink is supported by the supporting portion. The molding compound encapsulates the semiconductor chip and the heat sink. Heat from the semiconductor chip is efficiently dissipated from the die pad through the connecting bar, through the supporting portion, and through the heat sink.

Abstract: Semiconductor packages including a die pad, at least one connecting bar, at least one supporting portion, a plurality of leads, a semiconductor chip, a heat sink and a molding compound. The connecting bar connects the die pad and the supporting portion. The leads are electrically isolated from each other and the die pad. The semiconductor chip is disposed on the die pad and electrically connected to the leads. The heat sink is supported by the supporting portion. The molding compound encapsulates the semiconductor chip and the heat sink. Heat from the semiconductor chip is efficiently dissipated from the die pad through the connecting bar, through the supporting portion, and through the heat sink.