Patents by Inventor Fu-Zen Lin

Fu-Zen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chuck and method of making
    Patent number: 11075104
    Abstract: A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: July 27, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Fu-Zen Lin, Chien-Hsiang Chen, Chih-Shen Yang, Hsu-Shui Liu, Cheng-Yi Huang
  • SEMICONDUCTOR CHUCK AND METHOD OF MAKING
    Publication number: 20210066108
    Abstract: A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.
    Type: Application
    Filed: August 27, 2019
    Publication date: March 4, 2021
    Inventors: Fu-Zen Lin, Chien-Hsiang Chen, Chih-Shen Yang, Hsu-Shui Liu, Cheng-Yi Huang