Patents by Inventor Fu-Zhou Wei

Fu-Zhou Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Membrane circuit board and manufacturing method thereof
    Patent number: 11482387
    Abstract: A membrane circuit board includes a first film substrate, a second film substrate, an insulating spacer substrate and a waterproof structure. The first circuit layer is installed on the first film substrate. A second circuit layer is installed on the second film substrate. The insulating spacer substrate arranged between the first film substrate and the second film substrate. The first circuit layer is arranged between the first film substrate and the insulating spacer substrate. The second circuit layer is arranged between the second film substrate and the insulating spacer substrate. The waterproof structure includes a first welding layer and a second welding layer. The first welding layer is arranged between the first film substrate and the insulating spacer substrate. The second welding layer is arranged between the second film substrate and the insulating spacer substrate.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: October 25, 2022
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Liu-Bing Cai, Li-Xiong Deng, Fu-Zhou Wei, Li-Qiang Chen, Xiao-Ping Wang
  • MEMBRANE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20220068575
    Abstract: A membrane circuit board includes a first film substrate, a second film substrate, an insulating spacer substrate and a waterproof structure. The first circuit layer is installed on the first film substrate. A second circuit layer is installed on the second film substrate. The insulating spacer substrate arranged between the first film substrate and the second film substrate. The first circuit layer is arranged between the first film substrate and the insulating spacer substrate. The second circuit layer is arranged between the second film substrate and the insulating spacer substrate. The waterproof structure includes a first welding layer and a second welding layer. The first welding layer is arranged between the first film substrate and the insulating spacer substrate. The second welding layer is arranged between the second film substrate and the insulating spacer substrate.
    Type: Application
    Filed: September 24, 2020
    Publication date: March 3, 2022
    Inventors: Liu-Bing Cai, Li-Xiong Deng, Fu-Zhou Wei, Li-Qiang Chen, Xiao-Ping Wang