Patents by Inventor Fuad Doany
Fuad Doany has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9817193Abstract: An optoelectronic integrated circuit for coupling light to or from an optical waveguide formed in an optical device layer in a near-normal angle to that layer. In an embodiment, the integrated circuit comprises a semiconductor body including a metal-dielectric stack, an optical device layer, a buried oxide layer and a semiconductor substrate arranged in series between first and second opposite sides of the semiconductor body. At least one optical waveguide is formed in the optical device layer for guiding light in a defined plane in that device layer. Diffractive coupling elements are disposed in the optical device layer to couple light from the waveguide toward the second surface of the semiconductor body at a near-normal angle to the defined plane in the optical device layer. In an embodiment, an optical fiber is positioned against the semiconductor body for receiving the light from the coupling elements.Type: GrantFiled: May 26, 2017Date of Patent: November 14, 2017Assignee: International Business Machines CorporationInventors: Fuad Doany, Benjamin G. Lee, Clint L. Schow
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Publication number: 20170261704Abstract: An optoelectronic integrated circuit for coupling light to or from an optical waveguide formed in an optical device layer in a near-normal angle to that layer. In an embodiment, the integrated circuit comprises a semiconductor body including a metal-dielectric stack, an optical device layer, a buried oxide layer and a semiconductor substrate arranged in series between first and second opposite sides of the semiconductor body. At least one optical waveguide is formed in the optical device layer for guiding light in a defined plane in that device layer. Diffractive coupling elements are disposed in the optical device layer to couple light from the waveguide toward the second surface of the semiconductor body at a near-normal angle to the defined plane in the optical device layer. In an embodiment, an optical fiber is positioned against the semiconductor body for receiving the light from the coupling elements.Type: ApplicationFiled: May 26, 2017Publication date: September 14, 2017Inventors: Fuad Doany, Benjamin G. Lee, Clint L. Schow
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Patent number: 9671563Abstract: An optoelectronic integrated circuit for coupling light to or from an optical waveguide formed in an optical device layer in a near-normal angle to that layer. In an embodiment, the integrated circuit comprises a semiconductor body including a metal-dielectric stack, an optical device layer, a buried oxide layer and a semiconductor substrate arranged in series between first and second opposite sides of the semiconductor body. At least one optical waveguide is formed in the optical device layer for guiding light in a defined plane in that device layer. Diffractive coupling elements are disposed in the optical device layer to couple light from the waveguide toward the second surface of the semiconductor body at a near-normal angle to the defined plane in the optical device layer. In an embodiment, an optical fiber is positioned against the semiconductor body for receiving the light from the coupling elements.Type: GrantFiled: March 14, 2016Date of Patent: June 6, 2017Assignee: International Business Machines CorporationInventors: Fuad Doany, Benjamin G. Lee, Clint L. Schow
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Publication number: 20160195678Abstract: An optoelectronic integrated circuit for coupling light to or from an optical waveguide formed in an optical device layer in a near-normal angle to that layer. In an embodiment, the integrated circuit comprises a semiconductor body including a metal-dielectric stack, an optical device layer, a buried oxide layer and a semiconductor substrate arranged in series between first and second opposite sides of the semiconductor body. At least one optical waveguide is formed in the optical device layer for guiding light in a defined plane in that device layer. Diffractive coupling elements are disposed in the optical device layer to couple light from the waveguide toward the second surface of the semiconductor body at a near-normal angle to the defined plane in the optical device layer. In an embodiment, an optical fiber is positioned against the semiconductor body for receiving the light from the coupling elements.Type: ApplicationFiled: March 14, 2016Publication date: July 7, 2016Inventors: Fuad Doany, Benjamin G. Lee, Clint L. Schow
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Patent number: 9322987Abstract: An optical connector includes a fiber element incorporating one or more optical fibers, the optical fiber including a plurality of cores, and an optical element including an array of optical waveguides arranged in one or more layers so as to match the geometry of the plurality of cores of the optical fiber.Type: GrantFiled: August 27, 2013Date of Patent: April 26, 2016Assignee: International Business Machines CorporationInventors: Fuad Doany, Daniel M. Kuchta, Petar K. Pepeljugoski, Laurent Schares
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Patent number: 9285554Abstract: An optoelectronic integrated circuit for coupling light to or from an optical waveguide formed in an optical device layer in a near-normal angle to that layer. In an embodiment, the integrated circuit comprises a semiconductor body including a metal-dielectric stack, an optical device layer, a buried oxide layer and a semiconductor substrate arranged in series between first and second opposite sides of the semiconductor body. At least one optical waveguide is formed in the optical device layer for guiding light in a defined plane in that device layer. Diffractive coupling elements are disposed in the optical device layer to couple light from the waveguide toward the second surface of the semiconductor body at a near-normal angle to the defined plane in the optical device layer. In an embodiment, an optical fiber is positioned against the semiconductor body for receiving the light from the coupling elements.Type: GrantFiled: February 10, 2012Date of Patent: March 15, 2016Assignee: International Business Machines CorporationInventors: Fuad Doany, Benjamin G. Lee, Clint L. Schow
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Publication number: 20150063755Abstract: An optical connector includes a fiber element incorporating one or more optical fibers, the optical fiber including a plurality of cores, and an optical element including an array of optical waveguides arranged in one or more layers so as to match the geometry of the plurality of cores of the optical fiber.Type: ApplicationFiled: August 27, 2013Publication date: March 5, 2015Applicant: International Business Machines CorporationInventors: Fuad DOANY, Daniel M. Kuchta, Petar K. Pepeljugoski, Laurent Schares
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Publication number: 20130209026Abstract: An optoelectronic integrated circuit for coupling light to or from an optical waveguide formed in an optical device layer in a near-normal angle to that layer. In an embodiment, the integrated circuit comprises a semiconductor body including a metal-dielectric stack, an optical device layer, a buried oxide layer and a semiconductor substrate arranged in series between first and second opposite sides of the semiconductor body. At least one optical waveguide is formed in the optical device layer for guiding light in a defined plane in that device layer. Diffractive coupling elements are disposed in the optical device layer to couple light from the waveguide toward the second surface of the semiconductor body at a near-normal angle to the defined plane in the optical device layer. In an embodiment, an optical fiber is positioned against the semiconductor body for receiving the light from the coupling elements.Type: ApplicationFiled: February 10, 2012Publication date: August 15, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Fuad Doany, Benjamin G. Lee, Clint L. Schow
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Patent number: 8231284Abstract: A novel parallel optical module having combined optical signal transmit and receive function for high-speed performance. The optical module includes a plurality, e.g., sixteen 10-Gb/s transmitter and receiver channels for a 160-Gb/s bidirectional aggregate data rate. The module utilizes a single-chip CMOS optical transceiver containing both transmitter and receiver circuits. 16-channel high-speed photodiode (PD) and VCSEL arrays are flip-chip attached to the low-power CMOS IC. The substrate emitting/illuminated VCSEL and PD arrays operate at 985 nm and include collimating lenses integrated into the backside of the substrate. The IC-OE assembly is then flip-chip attached to a high density organic package forming the transceiver optical module. The exclusive use of flip-chip packaging for both the IC-to-optoelectronic (OE) devices and for the IC-to-organic package minimizes the module footprint and associated packaging parasitics.Type: GrantFiled: March 26, 2007Date of Patent: July 31, 2012Assignee: International Business Machines CorporationInventors: Fuad Doany, Clint L. Schow
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Publication number: 20120163811Abstract: A novel parallel optical module having combined optical signal transmit and receive function for high-speed performance. The optical module includes a plurality, e.g., sixteen 10-Gb/s transmitter and receiver channels for a 160-Gb/s bidirectional aggregate data rate. The module utilizes a single-chip CMOS optical transceiver containing both transmitter and receiver circuits. 16-channel high-speed photodiode (PD) and VCSEL arrays are flip-chip attached to the low-power CMOS IC. The substrate emitting/illuminated VCSEL and PD arrays operate at 985 nm and include collimating lenses integrated into the backside of the substrate. The IC-OE assembly is then flip-chip attached to a high density organic package forming the transceiver optical module. The exclusive use of flip-chip packaging for both the IC-to-optoelectronic (OE) devices and for the IC-to-organic package minimizes the module footprint and associated packaging parasitics.Type: ApplicationFiled: March 26, 2007Publication date: June 28, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Fuad Doany, Clint L. Schow
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Publication number: 20080019633Abstract: Apparatus and methods for packaging optical communication devices include optical bench structures, such as silicon-optical benches (SiOB). An optical communications apparatus includes an optical bench comprising a substrate having an electrical turning via formed therein. An optoelectronic (OE) chip and integrated circuit (IC) chip are mounted on the optical bench and electrically connected using the electrical turning via. The electrical turning via extends in directions both perpendicular and transverse to a surface of the substrate such that the OE chip and IC chip can be mounted on perpendicular surfaces of the optical bench in close proximity and electrically connected using the electrical turning via.Type: ApplicationFiled: July 30, 2007Publication date: January 24, 2008Inventors: Guy Cohen, Fuad Doany, Jeannine Trewhella
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Publication number: 20070284698Abstract: A method of fabricating a dielectric film comprising atoms of Si, C, O and H (hereinafter SiCOH) that has improved insulating properties as compared with prior art dielectric films, including prior art SiCOH dielectric films that are not subjected to the inventive deep ultra-violet (DUV) is disclosed. The improved properties include reduced current leakage which is achieved without adversely affecting (increasing) the dielectric constant of the SiCOH dielectric film. In accordance with the present invention, a SiCOH dielectric film exhibiting reduced current leakage and improved reliability is obtained by subjecting an as deposited SiCOH dielectric film to a DUV laser anneal. The DUV laser anneal step of the present invention likely removes the weakly bonded C from the film, thus improving leakage current.Type: ApplicationFiled: March 29, 2007Publication date: December 13, 2007Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alessandro Callegari, Stephen Cohen, Fuad Doany
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Publication number: 20070206908Abstract: Apparatus and methods for packaging optical communication devices include optical bench structures, such as silicon-optical benches (SiOB). An optical communications apparatus includes an optical bench comprising a substrate having an electrical turning via formed therein. An optoelectronic (OE) chip and integrated circuit (IC) chip are mounted on the optical bench and electrically connected using the electrical turning via. The electrical turning via extends in directions both perpendicular and transverse to a surface of the substrate such that the OE chip and IC chip can be mounted on perpendicular surfaces of the optical bench in close proximity and electrically connected using the electrical turning via.Type: ApplicationFiled: October 25, 2005Publication date: September 6, 2007Inventors: Guy Cohen, Fuad Doany, Jeannine Trewhella
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Publication number: 20070014527Abstract: Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.Type: ApplicationFiled: September 21, 2006Publication date: January 18, 2007Inventors: Evan Colgan, Fuad Doany, Bruce Furman, Daniel Stigliani
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Publication number: 20060040513Abstract: A method of fabricating a dielectric film comprising atoms of Si, C, O and H (hereinafter SiCOH) that has improved insulating properties as compared with prior art dielectric films, including prior art SiCOH dielectric films that are not subjected to the inventive deep ultra-violet (DUV) is disclosed. The improved properties include reduced current leakage which is achieved without adversely affecting (increasing) the dielectric constant of the SiCOH dielectric film. In accordance with the present invention, a SiCOH dielectric film exhibiting reduced current leakage and improved reliability is obtained by subjecting an as deposited SiCOH dielectric film to a DUV laser anneal. The DUV laser anneal step of the present invention likely removes the weakly bonded C from the film, thus improving leakage current.Type: ApplicationFiled: August 20, 2004Publication date: February 23, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alessandro Callegari, Stephan Cohen, Fuad Doany
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Publication number: 20050169597Abstract: Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.Type: ApplicationFiled: April 1, 2005Publication date: August 4, 2005Inventors: Evan Colgan, Fuad Doany, Bruce Furman, Daniel Stigliani
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Publication number: 20050063634Abstract: Apparatus and methods for packaging optical communication devices include optical bench structures, such as silicon-optical benches (SiOB). An optical communications apparatus includes an optical bench comprising a substrate having an electrical turning via formed therein. An optoelectronic (OE) chip and integrated circuit (IC) chip are mounted on the optical bench and electrically connected using the electrical turning via. The electrical turning via extends in directions both perpendicular and transverse to a surface of the substrate such that the OE chip and IC chip can be mounted on perpendicular surfaces of the optical bench in close proximity and electrically connected using the electrical turning via.Type: ApplicationFiled: September 24, 2003Publication date: March 24, 2005Applicant: International Business Machiness CorporationInventors: Guy Cohen, Fuad Doany, Jeannine Trewhella
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Patent number: 5621486Abstract: An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system having a light tunnel, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display.Type: GrantFiled: June 22, 1995Date of Patent: April 15, 1997Assignee: International Business Machines CorporationInventors: Fuad Doany, Derek B. Dove, Rama Singh, Alan Rosenbluth, George Chiu, Thomas Cipolla, Janusz Wilczynski