Patents by Inventor Fuen Siang Ng

Fuen Siang Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bilevel probe
    Patent number: 7102371
    Abstract: An apparatus for electrical testing of semiconductor devices is provided. A printed circuit board is provided. A first plurality of probe pins for probing bump connectors is electrically and mechanically connected to the printed circuit board. A second plurality of probe pins for probing probe pads is electrically and mechanically connected to the printed circuit board.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: September 5, 2006
    Assignee: National Semiconductor Corporation
    Inventors: Tze Kang Tang, Sek Hoi Chong, Chin Chai Gan, Fuen Siang Ng