Patents by Inventor Fuh-Yuh SHIH

Fuh-Yuh SHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical device package and method for manufacturing the same
    Patent number: 11837686
    Abstract: An optical device package includes a substrate, a light emitting device, a light detecting device, one or more electronic chips, a clear encapsulation layer and a patterned reflective layer. The substrate has a surface. The light emitting device is disposed on the surface of the substrate, the light detecting device is disposed on the surface of the substrate, and the light emitting device and the light detecting device have a gap. The one or more electronic chips are at least partially embedded in the substrate, and electrically connected to the light emitting device and the light detecting device. The clear encapsulation layer is disposed on the surface of the substrate and encapsulates the light emitting device and the light detecting device. The patterned reflective layer is disposed on an upper surface of the clear encapsulation layer and at least overlaps the gap between the light emitting device and the light detecting device in a projection direction perpendicular to the surface of the substrate.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: December 5, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chanyuan Liu, Kuo-Hsien Liao, Alex Chi-Hong Chan, Fuh-Yuh Shih
  • OPTICAL DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200185581
    Abstract: An optical device package includes a substrate, a light emitting device, a light detecting device, one or more electronic chips, a clear encapsulation layer and a patterned reflective layer. The substrate has a surface. The light emitting device is disposed on the surface of the substrate, the light detecting device is disposed on the surface of the substrate, and the light emitting device and the light detecting device have a gap. The one or more electronic chips are at least partially embedded in the substrate, and electrically connected to the light emitting device and the light detecting device. The clear encapsulation layer is disposed on the surface of the substrate and encapsulates the light emitting device and the light detecting device. The patterned reflective layer is disposed on an upper surface of the clear encapsulation layer and at least overlaps the gap between the light emitting device and the light detecting device in a projection direction perpendicular to the surface of the substrate.
    Type: Application
    Filed: December 6, 2019
    Publication date: June 11, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chanyuan LIU, Kuo-Hsien LIAO, Alex Chi-Hong CHAN, Fuh-Yuh SHIH