Patents by Inventor Fuhe Sun

Fuhe Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11212611
    Abstract: A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: December 28, 2021
    Assignees: HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD., HANGZHOU SILAN MICROELECTRONICS CO., LTD.
    Inventors: Yongxiang Wen, Fuhe Sun, Chen Liu, Wenchao Jin, Wenliang Sun
  • Publication number: 20210168497
    Abstract: A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.
    Type: Application
    Filed: January 23, 2020
    Publication date: June 3, 2021
    Inventors: Yongxiang Wen, Fuhe Sun, Chen Liu, Wenchao Jin, Wenliang Sun
  • Patent number: 9778175
    Abstract: A high-sensitivity terahertz micro-fluidic channel sensor and a preparation method thereof. The sensor includes a substrate and a cover layer, respectively provided with a metal plane reflector and a metal microstructure layer; a micro-fluidic channel is formed between the metal plane reflector and the metal microstructure layer; and when the micro-fluidic channel tests liquid, a composite structure formed of the metal microstructure layer, the test liquid and the metal plane reflector shows good absorption properties. The method includes forming a metal plane reflector and a metal microstructure layer on a substrate and a cover layer, respectively; fixedly connecting the substrate to the cover layer, and forming a closed micro-fluidic channel between the substrate and the cover layer; and forming a through via, communicated to the micro-fluidic channel, on the substrate and/or the cover layer, to form a flow channel for transferring liquid to be tested to or from the sensor.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: October 3, 2017
    Assignee: Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences
    Inventors: Qin Chen, Fuhe Sun
  • Publication number: 20160116402
    Abstract: A high-sensitivity terahertz micro-fluidic channel sensor and a preparation method thereof. The sensor includes a substrate and a cover layer, respectively provided with a metal plane reflector and a metal microstructure layer; a micro-fluidic channel is formed between the metal plane reflector and the metal microstructure layer; and when the micro-fluidic channel tests liquid, a composite structure formed of the metal microstructure layer, the test liquid and the metal plane reflector shows good absorption properties. The method includes forming a metal plane reflector and a metal microstructure layer on a substrate and a cover layer, respectively; fixedly connecting the substrate to the cover layer, and forming a closed micro-fluidic channel between the substrate and the cover layer; and forming a through via, communicated to the micro-fluidic channel, on the substrate and/or the cover layer, to form a flow channel for transferring liquid to be tested to or from the sensor.
    Type: Application
    Filed: July 11, 2014
    Publication date: April 28, 2016
    Inventors: Qin Chen, Fuhe Sun