Patents by Inventor Fujiang Lin

Fujiang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11394172
    Abstract: A high-speed high-current laser driver integrated circuit is invented. The laser driver includes an input stage circuit, a pre-drive circuit, a negative capacitance circuit, three parallel-connected output stages, and an active reverse termination circuit. A pair of voltage signals VIP, VIN are applied to the input stage circuit which amplifies these input signals to a pair of output voltage signals V1IP, V1IN. Then the voltage signals V1IP, V1IN are amplified by the pre-drive circuit to a pair of voltage signals V+, V? to the output stage circuit, and finally, a pair of modulated current signals IOP, ION are generated by the output stage circuit. The present invention does not use terminal resistance in the output stage circuit, so the power consumption of the circuit is much lower than that of the traditional circuit.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: July 19, 2022
    Assignees: ANHUI TRANSILICA MICROELECTRONICS CO., LTD., JIANGSU KEDA HENGXIN SEMICON TECH CO., LTD.
    Inventors: Fujiang Lin, Ahmed Wahba Abdalla Elsayed, Xi Li
  • Patent number: 11095093
    Abstract: A laser driver with high-speed and high-current and current modulating method thereof is invented. The laser driver includes a first driving unit and a second driving unit, each driving unit including a pre-drive amplifier circuit and a main drive amplifier circuit. The pre-drive amplifier circuit includes a first differential transistor pair circuit, a differential voltage conversion circuit, a DC common mode level reduction circuit and a first cascode current mirror circuit. The main drive amplifier circuit includes a second differential transistor pair circuit, a bandwidth boost circuit, a matching circuit and a second cascode current mirror circuit. The present invention avoids the enhancement of chip area caused by the use of passive inductors peaking mode to enhance bandwidth, and reduces the cost of chip, design complexity and circuit power consumption.
    Type: Grant
    Filed: January 12, 2020
    Date of Patent: August 17, 2021
    Assignees: ANHUI TRANSILICA MICROELECTRONICS CO., LTD., JIANGSU KEDA HENGXIN SEMICON TECH CO., LTD.
    Inventors: Fujiang Lin, Ahmed Wahba Abdalla Elsayed, Xi Li
  • Publication number: 20210151951
    Abstract: A high-speed high-current laser driver integrated circuit is invented. The laser driver includes an input stage circuit, a pre-drive circuit, a negative capacitance circuit, three parallel-connected output stages, and an active reverse termination circuit. A pair of voltage signals VIP, VIN are applied to the input stage circuit which amplifies these input signals to a pair of output voltage signals VIIP, VIIN. Then the voltage signals VIIP, VIIN are amplified by the pre-drive circuit to a pair of voltage signals V+, V? to the output stage circuit, and finally, a pair of modulated current signals IOP, ION are generated by the output stage circuit. The present invention does not use terminal resistance in the output stage circuit, so the power consumption of the circuit is much lower than that of the traditional circuit.
    Type: Application
    Filed: November 5, 2020
    Publication date: May 20, 2021
    Inventors: Fujiang Lin, Ahmed Wahba Abdalla Elsayed, Xi Li
  • Publication number: 20200251883
    Abstract: A laser driver with high-speed and high-current and current modulating method thereof is invented. The laser driver includes a first driving unit and a second driving unit, each driving unit including a pre-drive amplifier circuit and a main drive amplifier circuit. The pre-drive amplifier circuit includes a first differential transistor pair circuit, a differential voltage conversion circuit, a DC common mode level reduction circuit and a first cascode current mirror circuit. The main drive amplifier circuit includes a second differential transistor pair circuit, a bandwidth boost circuit, a matching circuit and a second cascode current mirror circuit. The present invention avoids the enhancement of chip area caused by the use of passive inductors peaking mode to enhance bandwidth, and reduces the cost of chip, design complexity and circuit power consumption.
    Type: Application
    Filed: January 12, 2020
    Publication date: August 6, 2020
    Inventors: Fujiang Lin, Ahmed Wahba Abdalla Elsayed, Xi Li
  • Publication number: 20150215042
    Abstract: The present disclosure provides a millimeter-wave waveguide communication system. The millimeter-wave waveguide communication system may comprise: a clock component, and at least two sets of millimeter-wave receiving/transmitting channels. The clock component is configured to provide a clock signal to sending ends and receiving ends of the two sets of millimeter-wave receiving/sending channels respectively. Each set of millimeter-wave receiving/sending channels comprises: a transmitter component, a receiver component and a transmission waveguide. The transmission waveguide is located between the transmitter component and the receiver component and is configured to provide a channel for millimeter-wave transmission. The top face, side face and/or bottom face of the transmission waveguide, except for active devices and accessories thereof, are plated with a metal conductive wall to form an electromagnetic shield from a transmission waveguide in an adjacent millimeter-wave receiving/sending channel.
    Type: Application
    Filed: February 24, 2012
    Publication date: July 30, 2015
    Applicant: Institute of Microelectrics, Chinese Academy of Sciences
    Inventors: Daniel Guidotti, Qidong Wang, Fujiang Lin, Guang Zhu
  • Publication number: 20050056827
    Abstract: Three configurations of double barrier resonant tunneling diodes (RTD) are provided along with methods of their fabrication. The tunneling barrier layers of the diode are formed of low band offset dielectric materials and produce a diode with good I-V characteristics including negative differential resistance (NDR) with good peak-to-valley ratios (PVR). Fabrication methods of the RTD start with silicon-on-insulator substrates (SOI), producing silicon quantum wells, and are, therefore, compatible with main stream CMOS technologies such as those applied to SOI double gate transistor fabrication. Alternatively, Ge-on-insulator or SiGe-on-insulator substrates can be used if the quantum well is to be formed of Ge or SiGe. The fabrication methods include the formation of both vertical and horizontal silicon quantum well layers. The vertically formed layer may be oriented so that its vertical sides are in any preferred crystallographic plane, such as the 100 or 110 planes.
    Type: Application
    Filed: January 29, 2004
    Publication date: March 17, 2005
    Inventors: Ming Li, Jagar Singh, Yong Hou, Narayanan Balasubramanian, Fujiang Lin
  • Patent number: 6121809
    Abstract: A differential phase splitter circuit for producing opposite phase signals from an input AC signal is provided. A first and second transistor is provided. The source of these transistors are connected to a common first node. Further, these transistors act as a differential amplifier. The gate of the first transistor receives an input AC signal. The drain of the first transistor produces a first output AC signal. Similarly, the drain of the second transistor produces a second output AC signal that is 180 degrees out of phase with the first output AC signal. A source resistor is provided, connected in series to the common first node and ground. Lastly, an LCR feedback circuit is provided. This feedback circuit is connected between the drain of the first transistor and the gate of the second transistor. The LCR feedback circuit couples at least a fraction of the amplitude of the first output AC signal to the gate of the second transistor for amplitude balancing and phase balancing.
    Type: Grant
    Filed: March 15, 1999
    Date of Patent: September 19, 2000
    Assignee: Institute of Microelectronics
    Inventors: Huainan Ma, Sher Jiun Fang, Fujiang Lin