Patents by Inventor Fujio FURUKAWA

Fujio FURUKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component module including a lead frame and an insulating resin having a thickness less than or equal to a thickness of the lead frame and method for producing same
    Patent number: 8847371
    Abstract: An electronic component module includes a double-sided mounting board having a front surface and a back surface; components mounted on the front surface and the back surface of the double-sided mounting board; an insulating resin sealing the components mounted on the front surface and the back surface; and a lead frame bonded to the back surface of the double-sided mounting board. The back surface of the double-sided mounting board is sealed with the insulating resin such that the lead frame is not covered by the insulating resin, and the thickness of the insulating resin sealing the components mounted on the back surface of the double-sided mounting board is less than or equal to the thickness of the lead frame.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: September 30, 2014
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Takayuki Otsuka, Fujio Furukawa, Ryuichi Wada, Makoto Kitazume, Toshiki Komiyama
  • ELECTRONIC COMPONENT MODULE AND METHOD FOR PRODUCING SAME
    Publication number: 20130200504
    Abstract: An electronic component module includes a double-sided mounting board having a front surface and a back surface; components mounted on the front surface and the back surface of the double-sided mounting board; an insulating resin sealing the components mounted on the front surface and the back surface; and a lead frame bonded to the back surface of the double-sided mounting board. The back surface of the double-sided mounting board is sealed with the insulating resin such that the lead frame is not covered by the insulating resin, and the thickness of the insulating resin sealing the components mounted on the back surface of the double-sided mounting board is less than or equal to the thickness of the lead frame.
    Type: Application
    Filed: February 4, 2013
    Publication date: August 8, 2013
    Applicant: MITSUMI ELECTRIC CO., LTD.
    Inventors: Takayuki OTSUKA, Fujio FURUKAWA, Ryuichi WADA, Makoto KITAZUME, Toshiki KOMIYAMA