Patents by Inventor Fujio Kakehi

Fujio Kakehi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of connecting a lead of a mounting part with a land of a circuit substrate
    Patent number: 5268536
    Abstract: A coating pattern is used for coating a conductive adhesive on a plurality of lands of a circuit substrate. According to the pattern, one land is coated with the conductive adhesive on the area corresponding to a tip of a downwardly inclined lead. An adjacent land is coated with the conductive adhesive except on the area corresponding to the tip of the lead. The pattern alternates on adjacent lands. Therefore, when the leads are connected with the lands of the circuit substrate, the conductive adhesive which is expanded in the vicinity of the tip of the lead does not come in contact with the conductive adhesive of an adjacent land.
    Type: Grant
    Filed: October 16, 1992
    Date of Patent: December 7, 1993
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Fujio Kakehi