Abstract: The present invention relates to an electrode material, an electrode, an electrical storage device and a lithium-ion capacitor, and the electrode material includes a carbon material and reduces its weight at a temperature not more than 650° C. by 20% relative to the weight thereof before heating when thermogravimetric analysis is performed on the electrode material with a heating rate of 5° C./min in an air flow at a rate of 100 ml/min.

Abstract: The present invention relates to a production process for an electrode material, an electrode and an electric storage device, and the production process for an electrode material comprises a step of heating a polymer having a silicon-containing unit and a silicon-non-containing unit.

Abstract: The present invention relates to an electrode material, an electrode, an electrical storage device and a lithium-ion capacitor, and the electrode material includes a carbon material and reduces its weight at a temperature not more than 650° C. by 20% relative to the weight thereof before heating when thermogravimetric analysis is performed on the electrode material with a heating rate of 5° C./min in an air flow at a rate of 100 ml/min.

Abstract: The present invention relates to a production process for an electrode material, an electrode and an electric storage device, and the production process for an electrode material comprises a step of heating a polymer having a silicon-containing unit and a silicon-non-containing unit.

Abstract: There are provided a polishing pad which exhibits excellent polishing stability and excellent slurry retainability during polishing and even after dressing, can prevent a reduction in polishing rate effectively and is also excellent in an ability to flatten an substrate to be polished, and a method for producing the polishing pad. The method comprises dispersing water-soluble particles such as ?-cyclodextrin into a crosslinking agent such as a polypropylene glycol so as to obtain a dispersion, mixing the dispersion with a polyisocyanate such as 4,4?-diphenylmethane diisocyanate and/or an isocyanate terminated urethane prepolymer, and reacting the mixed solution so as to obtain a polishing pad having the water-soluble particles dispersed in the matrix.

Abstract: There are provided a polishing pad which exhibits excellent polishing stability and excellent slurry retainability during polishing and even after dressing, can prevent a reduction in polishing rate effectively and is also excellent in an ability to flatten an substrate to be polished, and a method for producing the polishing pad. The method comprises dispersing water-soluble particles such as ?-cyclodextrin into a crosslinking agent such as a polypropylene glycol so as to obtain a dispersion, mixing the dispersion with a polyisocyanate such as 4,4?-diphenylmethane diisocyanate and/or an isocyanate terminated urethane prepolymer, and reacting the mixed solution so as to obtain a polishing pad having the water-soluble particles dispersed in the matrix.

Abstract: A polishing pad having a polishing layer which has specific composition and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 60° C. of 2 to 15 and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 90° C. of 4 to 20 and is made of a polyurethane or polyurethane-urea. This polishing pad suppresses the scratching of the surface to be polished and planarizes the surface efficiently. A polishing pad having a polishing layer containing water-soluble particles can achieve a higher removal rate.

Abstract: A chemical mechanical polishing pad which can be advantageously used for the polishing of a metal film or the polishing of an insulating film, provides a flat polished surface, enables slurry to be efficiently removed, has sufficiently long service life, can provide a high polishing rate and has the effect of reducing the number of scratches. This polishing pad has one or more grooves on its polishing surface, wherein the groove(s) is/are formed in the polishing surface in such a manner that it/they intersect(s) a single virtual straight line extending from the center portion toward the peripheral portion of the polishing surface a plurality of times and has/have a width of 0.1 to 1.5 mm and a depth of 0.9 to 9.8 mm, the shortest distance between adjacent intersections between it/them and the virtual straight line is 0.3 to 2.0 mm, and the ratio of the depth of the groove(s) to the thickness of the polishing pad is 1/7 to 1/1.1.

Abstract: A polishing pad having a polishing layer which has specific composition and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 60° C. of 2 to 15 and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 90° C. of 4 to 20 and is made of a polyurethane or polyurethane-urea. This polishing pad suppresses the scratching of the surface to be polished and planarizes the surface efficiently. A polishing pad having a polishing layer containing water-soluble particles can achieve a higher removal rate.

Abstract: A chemical mechanical polishing pad which can be advantageously used for the polishing of a metal film or the polishing of an insulating film, provides a flat polished surface, enables slurry to be efficiently removed, has sufficiently long service life, can provide a high polishing rate and has the effect of reducing the number of scratches. This polishing pad has one or more grooves on its polishing surface, wherein the groove(s) is/are formed in the polishing surface in such a manner that it/they intersect(s) a single virtual straight line extending from the center portion toward the peripheral portion of the polishing surface a plurality of times and has/have a width of 0.1 to 1.5 mm and a depth of 0.9 to 9.8 mm, the shortest distance between adjacent intersections between it/them and the virtual straight line is 0.3 to 2.0 mm, and the ratio of the depth of the groove(s) to the thickness of the polishing pad is 1/7 to 1/1.1.

Abstract: There are provided a polishing pad which exhibits excellent polishing stability and excellent slurry retainability during polishing and even after dressing, can prevent a reduction in polishing rate effectively and is also excellent in an ability to flatten an substrate to be polished, and a method for producing the polishing pad. The method comprises dispersing water-soluble particles such as &bgr;-cyclodextrin into a crosslinking agent such as a polypropylene glycol so as to obtain a dispersion, mixing the dispersion with a polyisocyanate such as 4,4′-diphenylmethane diisocyanate and/or an isocyanate terminated urethane prepolymer, and reacting the mixed solution so as to obtain a polishing pad having the water-soluble particles dispersed in the matrix.

Abstract: Polymer particles prepared by polymerizing polymerizable monomers by seed polymerization, with far more excellent polymerization stability than conventional seed polymerization processes, in the presence of a polymer emulsion comprising low molecular weight polymer particles, radically polymerizable in an aqueous system. The polymer particles are present in an amount of 0.5-30 parts by weight (on solid basis) per 100 parts by weight of polymerizable monomers, have a weight average molecular weight of 500-10,000 and are prepared by emulsion polymerization or soap-free polymerization. The seed polymerization is carried out by initially charging less than 30% by weight of said polymerizable monomers to the polymerization mixture, and after the polymerization conditions are established, by continuously or intermittently adding the remaining portion of said polymerizable monomers to the reaction system.

Abstract: Hollow polymer particles having at least two polymer layers, wherein (1) the particles have an average particle diameter in the range of 0.15 to 20 micrometers, (2) each of the particles has an average equivalent hollow diameter/equivalent particle diameter in the range of 0.2 to 0.8, (3) the proportion of a toluene-insoluble portion of the particles is 20 to 90% by weight, (4) the polymer particles have a melt flow rate at 180.degree. C. under 10 kgf/cm.sup.2 of 0.1 to 1 g/10 min., (5) the inside layer of the two polymer layers is composed of a crosslinked polymer and (6) the outside layer of the two polymer layers is composd of a non-crosslinked polymer. This invention also provides hollow crosslinked polymer particles wherein the proportion of a toluene-insoluble portion of the particles exceeds 85% by weight, the melt flow rate of the polymer particles at 180.degree. C. under 10 kgf/cm.sup.2 is less than 0.2 g/10 min., and the outside layer is composed of a crosslinked polymer.