Patents by Inventor Fujio Wada

Fujio Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
    Patent number: 4589010
    Abstract: A method for manufacturing a plastic encapsulated semiconductor device is provided which comprises the steps of: clamping by upper and lower molds at least external leads and strips of a semiconductor device assembly formed using a lead frame which has a first connecting band connected to the external leads extending from one side of a substrate support further used as a heat sink, and a second connecting band connected to the strips having portions of small cross-sectional areas and of a predetermined length and extending from the other side of the substrate support, the cross sections being perpendicular to an extending direction of the strips, so that the substrate support may float in a cavity formed by the upper and lower molds and parts of the portions of small cross-sectional areas may be disposed in the cavity and the remaining parts thereof may be disposed between the upper and lower molds; injecting a plastic into the cavity; and cutting the portions of small cross-sectional areas of the strips whic
    Type: Grant
    Filed: February 17, 1984
    Date of Patent: May 13, 1986
    Assignee: Matsushita Electronics Corporation
    Inventors: Kenichi Tateno, Masami Yokozawa, Hiroyuki Fujii, Mikio Nishikawa, Michio Katoh, Fujio Wada
  • Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
    Patent number: 4451973
    Abstract: A method for manufacturing a plastic encapsulated semiconductor device is provided which comprises the steps of: clamping by upper and lower molds at least external leads and strips of a semiconductor device assembly formed using a lead frame which has a first connecting band connected to the external leads extending from one side of a substrate support further used as a heat sink, and a second connecting band connected to the strips having portions of small cross-sectional areas and of a predetermined length and extending from the other side of the substrate support, the cross sections being perpendicular to an extending direction of the strips, so that the substrate support may float in a cavity formed by the upper and lower molds and parts of the portions of small cross-sectional areas may be disposed in the cavity and the remaining parts thereof may be disposed between the upper and lower molds; injecting a plastic into the cavity; and cutting the portions of small cross-sectional areas of the strips whic
    Type: Grant
    Filed: April 13, 1982
    Date of Patent: June 5, 1984
    Assignee: Matsushita Electronics Corporation
    Inventors: Kenichi Tateno, Masami Yokozawa, Hiroyuki Fujii, Mikio Nishikawa, Michio Katoh, Fujio Wada