Patents by Inventor Fujisaki ATSUSHI

Fujisaki ATSUSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE
    Publication number: 20130256876
    Abstract: A semiconductor package includes a semiconductor chip having a plurality of contact pads on a surface thereof, a plurality of main bumps on the contact pads, respectively. Each of the plurality of main bumps includes a first pillar layer on one of the contact pads and a first solder layer on the first pillar layer, and the first solder layer includes an upper portion having an overhang portion.
    Type: Application
    Filed: January 3, 2013
    Publication date: October 3, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ui-hyoung LEE, Moon-gi CHO, Mi-seok PARK, Sun-hee PARK, Hwan-sik LIM, Jin-ho CHOI, Fujisaki ATSUSHI