Patents by Inventor Fuk Yee Kwong

Fuk Yee Kwong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10093692
    Abstract: The present invention relates to a novel class of benzimidazolyl/imidazolyl phosphine ligands, methods of preparing such ligands via a simple one-pot protocol, and applications of the ligands in catalytic reactions.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: October 9, 2018
    Assignee: The Hong Kong Polytechnic University
    Inventors: Fuk Yee Kwong, Shun Man Wong, Chung Chiu Yeung
  • Publication number: 20160222042
    Abstract: The present invention relates to a novel class of benzimidazolyl/imidazolyl phosphine ligands, methods of preparing such ligands via a simple one-pot protocol, and applications of the ligands in catalytic reactions.
    Type: Application
    Filed: September 17, 2014
    Publication date: August 4, 2016
    Inventors: Fuk Yee KWONG, Shun Man WONG, Chung Chiu YEUNG
  • Patent number: 8212056
    Abstract: The present invention relates to indolyl phosphine ligands, and methods of making such ligands utilizing phenyl hydrazines and aryl ketones as the starting material. The present invention further includes uses of the ligands in the synthesis of pharmaceuticals, materials, and agriculture.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: July 3, 2012
    Assignee: The Hong Kong Polytechnic University
    Inventors: Fuk Yee Kwong, Chau Ming So
  • Publication number: 20090326243
    Abstract: The present invention relates to indolyl phosphine ligands, and methods of making such ligands utilizing phenyl hydrazines and aryl ketones as the starting material. The present invention further includes uses of the ligands in the synthesis of pharmaceuticals, materials, and agriculture.
    Type: Application
    Filed: June 30, 2008
    Publication date: December 31, 2009
    Applicant: The Hong Kong Polytechnic University
    Inventors: Fuk Yee Kwong, Chau Ming So